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Measuring device for multi-parameters of solid-liquid two-phase flow

A measuring device and multi-parameter technology, which is applied to measuring devices, measuring device shells, instruments, etc., can solve the problems of high cost, long measurement cycle, and single measurement parameters, and achieve the effects of simple structure, short measurement time and accurate measurement

Pending Publication Date: 2019-02-19
HENAN UNIV OF SCI & TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The technical problem to be solved by the present invention is to provide a multi-parameter measurement device for solid-liquid two-phase flow, which solves the existing problems of single measurement parameter, long measurement period, and high cost.

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  • Measuring device for multi-parameters of solid-liquid two-phase flow

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Embodiment Construction

[0018] Specific implementation modes (embodiments) of the present invention will be described below in conjunction with the accompanying drawings, so that those skilled in the art can better understand the present invention.

[0019] A multi-parameter measuring device for solid-liquid two-phase flow, comprising a box body 1 and a box body cover 5, a circular opening 103 is opened on the top of the box body 1, the box body cover 5 cooperates with the circular opening 103, and the box body cover 5 is respectively A thermal conductivity measuring mechanism and a density measuring mechanism are provided, and the density measuring mechanism includes an ultrasonic transducer fixed seat 12 arranged at the bottom of the box cover 5 and an ultrasonic transducer fixed seat 12 arranged in the ultrasonic transducer fixed seat 12 for measurement. The transducer 4 is provided with a plexiglass plate 3 directly below the ultrasonic transducer 4, and four guide rail chutes are uniformly arrang...

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Abstract

The invention provides a measuring device for multi-parameters of a solid-liquid two-phase flow, and relates to the technical field of measurement of basic parameters of the two-phase flow. The measuring device comprises a box body and a box cover. A circular opening is formed in the top of the box body, and is matched with the box cover. A measuring mechanism for the heat conduction coefficient and a density measuring mechanism are arranged on the box cover respectively. The density measuring mechanism comprises an ultrasonic transducer fixing seat arranged at the bottom of the box cover andan ultrasonic transducer arranged inside the ultrasonic transducer fixing seat for measuring, wherein an organic glass plate is arranged right under the ultrasonic transducer. The measuring mechanismfor the heat conduction coefficient comprises a glass tube arranged at the bottom of the box cover. A metal platinum wire is mounted on the core of the glass tube, and a wire is arranged on the surface of the glass tube. The wire and the metal platinum wire form a loop for measuring the thermal conductivity coefficient. According to the measuring device for multi-parameters of the solid-liquid two-phase flow, the measuring device has the beneficial effects that multi-parameter measurement, such as density, thermal conductivity, and the like, can be realized; that the structure is simple; and that the measurement result is more accurate.

Description

technical field [0001] The invention belongs to the technical field of two-phase flow basic parameter working fluid measurement, and in particular relates to a multi-parameter measurement device for solid-liquid two-phase flow. Background technique [0002] Thermal conductivity is one of the basic thermophysical properties of liquid materials. Thermal conductivity reflects the total energy state of the energy level of a solid system, and represents the state density and magnetic excitation of electrons and phonons, as well as electromagnetic radiation in some cases. With the development of science and technology and industry, the determination of thermal conductivity has been brought to different fields, including: aerospace, microelectronics technology, biotechnology, nuclear energy technology, new material development and other high-tech fields, as well as petrochemical, iron and steel metallurgy, construction Energy saving and other industrial fields. For example, in the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01D21/02G01D11/24
CPCG01D11/24G01D21/02Y02E30/30
Inventor 莫秀兴陈朝帅梁坤峰杨书伟赵文正
Owner HENAN UNIV OF SCI & TECH
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