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A kind of composite insulation board and preparation method thereof

A technology of composite thermal insulation and heat insulation layer, which is applied in thermal insulation, mechanical equipment, pipeline protection, etc. It can solve the problems of limited material application scenarios, reduced thermal insulation effect, narrow thermal insulation interval, etc., and achieves light and thin thickness and reduced packaging Scale, the effect of small changes in ambient temperature

Active Publication Date: 2021-09-24
中山科邦化工材料技术有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the increasing complexity of industrial products, higher requirements are put forward for the application of thermal insulation materials. Due to the differences in materials themselves, general thermal insulation materials have better effects in a specific temperature range. When they exceed or fall below this range, their thermal insulation effect will decrease. For many specific process applications, it is required that the material has a good thermal insulation effect under high temperature conditions, and it is also required to have a good thermal insulation effect under low temperature conditions, even below 0°C. All have thick and heavy partition layers, which greatly limit the miniaturization development of equipment or products in production applications, and the thermal insulation interval of various materials is narrow, which also limits the application scenarios of materials

Method used

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  • A kind of composite insulation board and preparation method thereof
  • A kind of composite insulation board and preparation method thereof
  • A kind of composite insulation board and preparation method thereof

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Embodiment Construction

[0025] Below in conjunction with specific embodiment 1-6, the present invention will be further described:

[0026] A preparation method of a composite insulation board, comprising the steps of:

[0027] 1) Mix inorganic silicates or phosphates, silicone resins, heat-reflecting materials, and floating beads according to the ratio and mix thoroughly for 15 minutes to prepare the first layer of adhesive;

[0028] 2) Lay the substrate on the bottom of the prefabricated mold, mix and stir the ceramic fiber, floating beads, heat reflective material, and inorganic resin for 25 minutes, and lay it on the substrate at the bottom of the prefabricated mold with a thickness of 8-25mm and a relative humidity of 45%. Dry for 1 to 3 hours to obtain the first heat insulation layer;

[0029] 3) Coat the first layer of adhesive on the first heat insulation layer with a thickness of 3-5 mm, then mix and stir the airgel, inorganic resin, silicone resin, and curing agent in proportion to prepare...

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Abstract

The invention discloses a composite thermal insulation board and a preparation method thereof. The key points of the technical solution are: a first heat insulation layer is included, and one side of the first heat insulation layer is sequentially provided with a second heat insulation layer and a third heat insulation layer. layer and the fourth heat insulation layer, and the heat insulation layers are bonded with an adhesive, and the first heat insulation layer is composed of 15-25% by weight of ceramic fiber, 10-20% of ceramsite, and 15% of floating beads. ~25%, heat reflective material 5~30%, inorganic resin 30~60%. A composite thermal insulation board of the present invention is provided with a multi-layer structure for thermal insulation, which can meet the thermal insulation requirements of multiple temperature ranges, and the thickness of the thermal insulation board itself is greatly shortened, so it can be applied to more production scenarios.

Description

【Technical field】 [0001] The invention belongs to the technical field of thermal insulation materials, and in particular relates to a composite thermal insulation board and a preparation method thereof. 【Background technique】 [0002] With the increasing complexity of industrial products, higher requirements are put forward for the application of thermal insulation materials. Due to the differences in materials themselves, general thermal insulation materials have better effects in a specific temperature range. When they exceed or fall below this range, their thermal insulation effect will decrease. For many specific process applications, it is required that the material has a good thermal insulation effect at high temperature, and it is also required to have a good thermal insulation effect at low temperature, even below 0°C. All have thick and heavy partition layers, which greatly limit the miniaturization of equipment or products in production applications, and the therma...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F16L59/02C04B26/14C09D183/04C09D7/40C09D163/00C09D175/04C09D5/33
CPCF16L59/029C09D163/00C09D183/04C04B26/14C09D5/004C09D7/61C09J175/06C09J11/04F16L59/028C08K2003/2227C04B14/46C04B18/082C04B2103/0068C08K7/08C08K3/36C08K3/22C08K7/22C08L67/04C08K3/34
Inventor 栾焕光吕文东王淦汪涛陈和锐
Owner 中山科邦化工材料技术有限公司
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