Beam splitting laser cutting method for silicon-based wafer
A laser cutting, silicon-based crystal technology, used in laser welding equipment, welding equipment, metal processing equipment, etc., to enhance mobility, reduce risks, and improve cutting quality.
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[0045] In the following, the present invention will be further described with reference to the drawings and specific implementations.
[0046] First, the conceptual design of the present invention is described as follows:
[0047] 1. Introduction to cutting process
[0048] Filming steps:
[0049] Such as figure 1 As shown, the silicon-based wafer 101 and the iron ring 102 are attached to the film 103, and the film part outside the iron ring 102 is scratched with a blade, and the film part inside the iron ring 102 is retained.
[0050] Purpose: Attach the silicon-based wafer 101 to the film 103 and fix it with the iron ring 102 to facilitate processing, cutting, and patching.
[0051] Cutting steps:
[0052] Such as figure 2 As shown, the wafer is cut once or multiple times in a certain cutting manner according to a certain cutting mode, such as depth, speed, position, and width.
[0053] Purpose: Divide the entire wafer into independent, functional chips 10.
[0054] UV irradiation ste...
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