Conductive treatment technology for insulating layer film surface

A technology of insulating film and processing technology, which is applied in the direction of metal material coating process, superimposed layer plating, coating, etc., can solve the problems of gas residue and cavity formation, and achieve firm adhesion, good exhaust performance, The effect of good electrical conductivity and electromagnetic shielding effect

Active Publication Date: 2019-02-15
SHENZHEN KNQ SCI & TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a conductive treatment process on the surface of an insulating film, which aims to solve the problem of gas remaining between the shielding film and the target due to the bright film layer during use of the metal layer of the electromagnetic shielding film prepared in the prior art. The problem of forming cavities

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] A conductive treatment method on the surface of an insulating film, comprising the following steps:

[0045] S11. Provide a base film with a thickness of 15 μm to 200 μm, uniformly coat a silicone-free release agent or silicone oil of 1 μm to 30 μm on the surface of the base film, cure with UV, and then bake and cure at 50 ° C to 180 ° C to form a release type Layered carrier film; evenly coat modified epoxy resin glue or high-temperature resistant ink with a thickness of 3 μm to 50 μm on the carrier film layer, and bake and cure at 50 ° C to 180 ° C to form an insulating layer.

[0046] S12. The vacuum plating pressure is 1×10 -2 Pa, the working vacuum plating pressure is 0.1~1Pa, the speed is 0.5~5m / min, the resistance value is ≤20Ω, the working voltage is 500~1000V, the working current is 230A, and the argon gas volume is 20~500SCCM. The insulating layer is pretreated in a manner.

[0047] S13. Place the insulating layer pretreated by vacuum plating in an alkaline ...

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Abstract

The invention provides a conductive treatment technology for the insulating film surface. The conductive treatment technology comprises the following steps that a carrier film is provided, an insulating layer is prepared on at least one surface of the carrier film, and the surface resistance of the insulating layer is larger than 5 M omega; the vacuum plating manner is adopted for conducting pretreatment on the surface, away from the carrier film, of the insulating layer, and a vacuum metal layer is formed on the surface of the insulating layer; the pretreated insulating film is arranged in analkaline electrolyte, at least one-time surface deposition treatment is conducted on the surface of the vacuum metal layer through an electroplating deposition method, and a metal coating semi-finished product is formed; and the metal coating semi-finished product is arranged in micro-etching liquid, surface micro-etching treatment is conducted on the metal coating semi-finished product, and a metal coating with a surface porous structure is formed.

Description

technical field [0001] The invention belongs to the technical field of electromagnetic shielding films, and in particular relates to a conductive treatment process for the surface of an insulating film. Background technique [0002] With the rapid development of the modern electronics industry, a large number of electrical appliances and electronic equipment are widely used in industrial production and people's daily life, which promotes the development of industrial technology, improves people's lives, and improves people's quality of life. However, electrical appliances and electronic equipment will radiate a large amount of electromagnetic waves during use, and electromagnetic waves have caused non-negligible harm to the normal and safe operation of electronic equipment and the living environment of human beings. With the rapid increase in the number of various wireless communication systems and high-frequency electronic devices, electromagnetic interference phenomena and...

Claims

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Application Information

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IPC IPC(8): C23C28/02C25D5/48C23C14/14H05K9/00
CPCC23C14/14C23C28/02C25D5/48H05K9/0084
Inventor 李克贵陈耀
Owner SHENZHEN KNQ SCI & TECH CO LTD
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