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Photosensitive composition, pattern forming method, cured product and display device

A technology of photosensitive composition and cured product, which is applied in the direction of bonding method, photolithographic process exposure device, photosensitive material processing, etc., to achieve the effect of ensuring high height and good sensitivity

Pending Publication Date: 2019-01-29
TOKYO OHKA KOGYO CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0011] However, in the photosensitive composition described in Patent Document 1, although the sensitivity is excellent, on the other hand, there is a problem that it is not always easy to achieve the purpose of exposing through a halftone mask. In the pattern, a height difference is sufficiently formed between the full-tone exposed part and the half-tone exposed part, and a sufficient height of the half-tone exposed part is ensured

Method used

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  • Photosensitive composition, pattern forming method, cured product and display device
  • Photosensitive composition, pattern forming method, cured product and display device
  • Photosensitive composition, pattern forming method, cured product and display device

Examples

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preparation example Construction

[0594] "Preparation method of photosensitive composition"

[0595] The photosensitive composition according to the present invention can be prepared by uniformly stirring and mixing the above-mentioned components to dissolve and disperse them uniformly, and then, if necessary, filtering with a filter such as a 0.2 μm membrane filter.

[0596] "Cured product forming method and cured product"

[0597] The method for forming a cured product is the same as the conventional method for forming a cured product using a photosensitive composition except that the above-mentioned photosensitive composition is used.

[0598]The method of forming a cured product using the above-mentioned photosensitive composition is not particularly limited, and may be appropriately selected from conventionally employed methods. The cured product can be formed into a molded product having a desired shape by controlling the shape of the coating film at the time of coating the photosensitive composition an...

Embodiment 1 and comparative example 1～4

[0630] 3 parts by mass of a photopolymerization initiator (A), 38 parts by mass of a photopolymerizable compound (B1), and 62 parts by mass of a resin (B2) were dissolved in an organic solvent so that the solid content concentration was 24 mass % to prepare a photosensitive resin. combination.

[0631] As the photopolymerization initiator (A), the following PI-1, PI-2, and PI-3 were used. The light absorption characteristics of these photopolymerization initiators are shown in Table 1 below. The numerical value of the gram light absorption coefficient of PI-3 in Table 1 is the value at 400 nm.

[0632] [chemical formula 60]

[0633]

[0634] [Table 1]

[0635]

[0636] The kind and quantity of the photoinitiator used in Example 1 and Comparative Examples 1-4 are as described in Table 2 below.

[0637] As the photopolymerizable compound (B1), dipentaerythritol hexaacrylate was used.

[0638] As the resin (B2), an acrylic resin (Mw: 10000) composed of the following st...

Embodiment 2 and comparative example 5

[0668] 5 parts by mass of a photopolymerization initiator (A), 10 parts by mass of a photopolymerizable compound (B1), 32 parts by mass of a resin (B2), 8 parts by mass of carbon black, and 34 parts by mass of a perylene pigment were prepared so that the solid content concentration was 25 mass %. Parts by mass and 6 parts by mass of a dispersant were dissolved and dispersed in an organic solvent to prepare a photosensitive composition.

[0669] As the photopolymerization initiator (A), the aforementioned PI-1 and PI-2 were used. The kind and quantity of a photoinitiator are as described in Table 3. As the photopolymerizable compound (B1), 3 parts by mass of tetraethylene glycol dimethacrylate and 7 parts by mass of dipentaerythritol hexaacrylate were used.

[0670] As the resin (B2), Cardo resin synthesized by the following method was used.

[0671] At first, in the 500mL four-necked bottle, 235g of bisphenol fluorene type epoxy resin (epoxy equivalent weight 235), 110mg of ...

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Abstract

The invention provides a photosensitive composition which has excelent light transmittance and high exposure sensitivity, and a sufficiently cured product can be formed through exposure. When exposureis performed by means of a half tone mask at the middle part, a sufficient height difference can be formed between a full tone exposure part and a half tone exposure part in a formed pattern, and furthermore the sufficient height of the half tone exposure part can be ensured. The invention further provides a pattern forming method, a cured product of the photosensitive composition, a photosensitive adhesive with the photosensitive composition and an adhering method of an adhered object with the photosensitive composition. According to the photosensitve composition, more than two oxime ester compositions which have peaks in a wavelength area above 320 nm and below 400 nm in an absoprtion spectrum and furthermore the highest wavelengths of the peaks are different from each other are used asphotopolymerization initiators (A), and the compound with a molar absorption coefficient above 10 at a random wavelength in the wavelength area above 400nm.

Description

technical field [0001] The present invention relates to a photosensitive composition, a pattern forming method using the photosensitive composition, a cured product formed using the photosensitive composition, and a display device including the cured product. Background technique [0002] In a panel for a display device such as a liquid crystal display device, materials such as an insulating film and a spacer need to efficiently transmit light emitted from a light source such as a backlight. Therefore, in order to form the pattern of an insulating film and a spacer, the photosensitive composition which provides a transparent cured film by exposure is used. By selectively exposing such a photosensitive composition, a pattern of a transparent cured film can be formed. [0003] In addition, in panels for display devices, patterned light-shielding films such as black matrices and black column spacers are often formed. In such use, various photosensitive compositions containing...

Claims

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Application Information

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IPC IPC(8): G03F7/027G03F7/028G03F7/004
CPCG03F7/004G03F7/027G03F7/028G03F7/031G03F7/20G03F7/30C09J5/00C09J2301/416
Inventor 片野彰引田二郎盐田大
Owner TOKYO OHKA KOGYO CO LTD
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