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Preparation method of BN/epoxy resin heat conductive insulation composite material

An epoxy resin and thermal insulation technology, which is applied in the field of preparation of boron nitride/epoxy resin composite materials, can solve the problems such as the inability to form a good thermal conduction path, the inability to disperse, and the easy occurrence of pores, so as to achieve favorable heat transfer. , The effect of inhibiting the generation of pores, simple and efficient operation

Pending Publication Date: 2019-01-29
JILIN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, there have been studies to prepare epoxy resin composites with high thermal conductivity by directly adding cubic boron nitride powder to the epoxy resin matrix, but directly adding hexagonal boron nitride requires a very high filling amount to significantly improve the environmental performance Oxygen resin thermal conductivity
Hexagonal boron nitride has poor dispersion in epoxy resin, is easy to agglomerate, and is not tightly connected with the matrix, and pores are prone to appear, thereby increasing the thermal resistance of the composite material interface
[0005] Whether it is hexagonal or cubic boron nitride, there are very few chemical groups on the surface, and the surface properties are stable. When it is added to the heat-conducting matrix, it cannot be well dispersed, let alone form a heat conduction path, and the thermal conductivity is low.

Method used

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  • Preparation method of BN/epoxy resin heat conductive insulation composite material
  • Preparation method of BN/epoxy resin heat conductive insulation composite material
  • Preparation method of BN/epoxy resin heat conductive insulation composite material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Embodiment 1: add the example of hexagonal boron nitride micropowder

[0033] (1) Weigh 0.75g of hexagonal boron nitride micropowder (h-BN) with a particle size of about 44 microns, place it in the ark, heat it to 1000°C in the air at a heating rate of 10°C / min, and keep it warm After 2h, cool down to room temperature naturally after heating, take out the sample and grind it carefully.

[0034] (2) Take the silane coupling agent (KH-550) with 5% mass of hexagonal boron nitride micropowder, drop it into the absolute ethanol aqueous solution, the mass ratio of the silane coupling agent, absolute ethanol and deionized water is 1:144 :16, magnetically stir the solution for 30min, after the silane coupling agent is fully hydrolyzed, add annealed hexagonal boron nitride micropowder, heat in a water bath to 60°C and stir for 2h, cool naturally after stirring, vacuum filter and wash 3 times with absolute ethanol , and dried in a vacuum oven at 110° C. for 12 hours to obtain mo...

Embodiment 2

[0036] Embodiment 2: the example of adding hexagonal boron nitride nanosheets

[0037] (1) Weigh 0.75 g of hexagonal boron nitride nanosheets with a thickness of about 50 nm, place them in the ark, and heat them to 1000 °C in the air at a heating rate of 10 °C / min, and keep them warm for 2 hours. After cooling to room temperature, the samples were taken out and carefully ground.

[0038] (2) Get the silane coupling agent KH-550 of 5% of the quality of the hexagonal boron nitride nanosheets, drop it into the absolute ethanol aqueous solution, the mass ratio of the silane coupling agent to absolute ethanol and deionized water is 1:144: 16. Magnetically stir the solution for 30 minutes. After the silane coupling agent is fully hydrolyzed, add the annealed hexagonal boron nitride nanosheets, heat in a water bath to 60°C and stir for 2 hours. After stirring, cool naturally, and vacuum filter and wash with absolute ethanol for 3 times. , dried in a vacuum oven at 110° C. for 12 hou...

Embodiment 3

[0040] Embodiment 3: add the example of hexagonal boron nitride micropowder and cubic boron nitride micropowder

[0041] (1) Weigh 0.75g of hexagonal boron nitride micropowder (h-BN) with a particle size of about 9 microns, place it in the ark, heat it to 1000°C in the air at a heating rate of 10°C / min, and keep it warm After 2h, cool down to room temperature naturally after heating, take out the sample and grind it carefully. Weigh 2.25g of cubic boron nitride micropowder (c-BN) with a particle size of about 44 microns, place it in the ark, heat it to 750°C in the air at a heating rate of 10°C / min, and keep it warm for 1h. After completion, it was naturally cooled to room temperature, and the samples were taken out and carefully ground.

[0042] (2) Take the silane coupling agent KH-550 with 5% mass of hexagonal boron nitride micropowder, drop it into the absolute ethanol aqueous solution, the mass ratio of the silane coupling agent, absolute ethanol and deionized water is 1...

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Abstract

The invention provides a preparation method of a BN / epoxy resin heat conductive insulation composite material and belongs to the field of preparation of heat conductive insulation composite materials.The method includes: firstly, performing annealing pretreatment to BN powder and then surface modification with a silane coupling agent; then according to certain ratio, filling an epoxy resin matrixwith the modified hexagonal BN micropowder and the modified cubic BN micropowder. The method is simple process, wherein by adding the BN in different appearances, dimensions and phase structures, effective heat conduction channels are formed to finally improve the heat conductivity of the epoxy resin. After modification, the interface combination between the HBN and the resin is strong, wherein the sheet-like HBN and bulk CBN are overlapped in the epoxy resin to form excellent heat conductive network, thus effectively reducing interfacial thermo-resistance. The composite material is beneficial to quick transmission of heat, improves heat conductivity of the epoxy resin, has excellent insulation performance, and is improved in mechanical property.

Description

technical field [0001] The invention belongs to the technical field of preparation of thermally conductive and insulating composite materials, in particular to the surface modification of boron nitride and the preparation method of boron nitride / epoxy resin composite materials. Background technique [0002] Electronic components are the foundation of the electronics industry. The rapid development of assembly technology and integration technology in the field of microelectronic packaging, the increasing miniaturization and high frequency of electronic devices and logic circuits, etc. all require high thermal conductivity insulating materials with good heat resistance and low expansion. Therefore, packaging techniques and materials are crucial to ensure the proper functioning of electronic components. [0003] At present, the commonly used electronic packaging materials are mainly plastic packaging. Among them, epoxy resin materials have the advantages of low cost, simple mo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K9/06C08K3/38
CPCC08K3/38C08K9/06C08K2003/385C08K2201/014C08L63/00
Inventor 殷红张誉元高伟李宇靖何月孙晓燕
Owner JILIN UNIV
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