Heat dissipating device and a chassis

A heat dissipation device and chassis technology, which is applied in the direction of cooling/ventilation/heating transformation, electrical components, electrical equipment structural parts, etc., can solve the problems of inability to solve high-power chassis heat dissipation, complex structure of high-power chassis, and inability to effectively dissipate heat from heat sources, etc. , to achieve the effect of simple structure, effective heat dissipation and strong versatility

Pending Publication Date: 2019-01-22
PROSE TECH CO LTD
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Problems solved by technology

[0004] However, the structure of the above-mentioned scheme is too complicated, and it is not easy to produce and assemble. Moreover, the structure of the high-power chassis itself is relatively complicated, and the distance between the heat source and the radiator is often arranged far away. In particular, it cannot solve the heat dissipation problem of high-power chassis

Method used

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  • Heat dissipating device and a chassis
  • Heat dissipating device and a chassis
  • Heat dissipating device and a chassis

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Embodiment Construction

[0025] The technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the present invention.

[0026] Such as figure 1 As shown, the heat dissipation device of the present invention includes a heat pipe radiator 2 and an independent air duct module 3, the independent air duct module 3 is integrated with a fan 4, one end of the heat pipe radiator 2 is connected to the independent air duct module 3, and the other end is connected to the electronic Components form heat exchange. By realizing modular production and modular assembly, the versatility of components is effectively improved. Combined with the long-distance heat transmission properties of heat pipe radiators, it can effectively dissipate heat from distant heat sources, and the versatility of equipment is greatly improved.

[0027] Specifically, as figure 1 and figure 2 As shown, the heat pipe radiator 2 includes cooli...

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Abstract

The invention discloses a heat dissipation device which comprises an independent air duct module and at least one heat pipe radiator, wherein the heat pipe radiator comprises a heat collecting fin, aheat pipe and a heat dissipation fin which are connected in turn; a cavity is formed in the independent air duct module; The invention also discloses a chassis with a heat dissipation device. The chassis can effectively dissipate heat from a heat source far from the chassis through a modular air duct design, simple structure and an integral scheme formed by combining a heat pipe radiator.

Description

technical field [0001] The invention relates to a heat dissipation technology for electronic devices, in particular to a heat dissipation device and a chassis. Background technique [0002] With the rapid development of electronics and power technology, the modularization and integration of electronic components have been greatly improved. The higher the integration, the higher the heat generated by electronic components. If the heat cannot be dissipated in time, the reliability of electronic equipment will be reduced. In order to ensure the normal operation of the heating electronic components, a cooling device is usually installed on the heating electronic components to discharge the heat generated by them. [0003] CN203225987 discloses a heat dissipation device with an independent air duct. This patent adopts an upward draft type heat dissipation method, and the form of upward draft and downward suction can prevent dust or other polluting media from falling into the heat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20136H05K7/20409
Inventor 单建兵
Owner PROSE TECH CO LTD
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