Maskless parallel pick-and-place transfer of micro-devices

Abstract

A method of surface mounting micro-devices includes adhering a first plurality of micro-devices on a donor substrate to a transfer surface with an adhesive layer, removing the first plurality of micro-devices from donor substrate while the first plurality of micro-devices remain adhered to the transfer surface, positioning the transfer surface relative to a destination substrate so that a subset of the plurality of micro-devices on the transfer surface abut a plurality of receiving positions on the destination substrate, the subset including one or more micro-devices but less than all of micro-devices of the plurality of micro-devices, selectively neutralizing one or more of regions of the adhesive layer on the transfer surface corresponding to the subset of micro-device to light to detachthe subset of micro-devices from the adhesive layer, and separating the transfer surface from the destination substrate such that the subset of micro-devices remain on the destination substrate.

Description

technical field [0001] The present disclosure generally relates to the transfer of microdevices from a donor substrate to a target substrate. Background technique [0002] Many products contain arrays of individual devices on a substrate, where the devices are addressable or controlled by circuitry on the substrate. A device can be considered a micro-device when the individual devices are on the micron scale (eg, less than 100 microns across). In general, microdevices can be fabricated using a series of microfabrication techniques such as deposition, photolithography and etching to deposit and pattern a series of layers. [0003] One method for fabricating a device comprising an array of individual microdevices is to fabricate the individual microdevices directly on a substrate that will form part of the product. Such techniques have been used, for example, to manufacture TFT panels and color filter panels for active matrix liquid crystal displays (LCDs). [0004] One pro...

AI Technical Summary

Problems solved by technology

In particular, the direct deposition and growth of III-V semiconductor micro-LEDs on the final display substrate raises technical and manufacturing hurdles

Additionally, micro-LED panels are difficult to fabricate in curved or bendable displays

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