Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Data replication

A technology of data value and controller, applied in the direction of electrical digital data processing, input/output process of data processing, digital memory information, etc., can solve problems such as high time cost and so on

Active Publication Date: 2018-12-14
MICRON TECH INC
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The time it takes to complete an operating cycle is costly in terms of processing and computing performance and power consumption of the computing device and / or system

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Data replication
  • Data replication
  • Data replication

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0018] The present invention includes apparatus and methods for data replication. An example apparatus includes: a plurality of sensing circuits including respective sense amplifiers and computing components; and a controller. The controller may be configured to cause replication of data values ​​stored in the first computing component such that the data values ​​are propagated to the second computing component.

[0019] Carry propagation (eg, the transfer of data between storage locations in a memory device) can be a bottleneck for various arithmetic operations, such as horizontal arithmetic operations. As used herein, horizontal arithmetic operations include operations in which the same number of bits are located in different memory locations.

[0020] In some embodiments, the amount of time and / or power consumed by the carry-propagation operation and / or the amount of physical wiring for the carry-propagation operation may be reduced compared to some approaches. For exampl...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention includes apparatuses and methods for data replication. An example apparatus includes a plurality of sensing circuitries comprising respective sense amplifiers and computing components; and a controller. The controller may be configured to cause replication of a data value stored in a first computing component such that the data value is propagated to a second computing component.

Description

technical field [0001] The present invention relates generally to semiconductor memory and methods, and more particularly, the present invention relates to apparatus and methods for data replication. Background technique [0002] Memory devices are often provided as internal semiconductor integrated circuits in computers or other electronic systems. There are many different types of memory, including volatile and non-volatile memory. Volatile memory may require power to maintain its data (eg, host data, error data, etc.) and includes random access memory (RAM), dynamic random access memory (DRAM), static random access memory (SRAM), synchronous Dynamic Random Access Memory (SDRAM) and Thyristor Random Access Memory (TRAM), etc. Non-volatile memory can provide permanent data by retaining stored data when power is not supplied and can include NAND flash memory, NOR flash memory, and resistive variable memory such as phase change random access memory (PCRAM), resistive random...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G11C7/06G11C7/08G11C7/22
CPCG11C7/062G11C7/08G11C7/22G06F3/0625G11C7/1006G11C11/4096G11C2207/002G11C2207/005G06F3/065G06F3/0619G06F3/0688
Inventor J·J·威尔科克
Owner MICRON TECH INC
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products