Miniature surface-mounted ignition resistor and preparation method thereof
An ignition resistor, surface-mounted technology, applied in the field of miniature surface-mounted ignition resistors and its preparation, can solve the problems of large package size, poor safety, high ignition current, etc., and achieve small package size, short ignition time, and high ignition current low effect
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Embodiment 1
[0051] Such as figure 1 As shown, a specific embodiment of the present invention discloses a miniature surface-mounted ignition resistor, which includes a substrate 1, a resistive layer 2, a protective layer 3, a welding pad 4, and a surface-mounted ignition resistor. Connection layer 5, copper layer 6, nickel layer 7, tin layer 8.
[0052] The upper surface of the substrate 1 is provided with a resistance layer 2, and the two ends of the lower surface are respectively provided with pads 4; the two ends of the resistance layer 2 are electrically connected to the corresponding pads 4 through the surface and back lapping layers 5 respectively; the middle part of the upper surface of the resistance layer 2 is A protective layer 3 is also provided, and the two sides of the protective layer 3 are closely connected with the corresponding sides of the front and back lapping layers 5; Preferably, the thickness of the copper layer 6 is 0.01-0.03 mm, the thickness of the nickel layer 7...
Embodiment 2
[0067] Such as image 3 As shown, a preparation method for preparing the miniature surface mount type ignition resistor described in Example 1 comprises the steps:
[0068] S1. Cleaning the substrate 1 to remove oil stains and impurities on its surface.
[0069] S2. Prepare pads 4 at both ends of the lower surface of the substrate 1 . Specifically, pads 4 are respectively prepared on both ends of the lower surface of the substrate 1 by at least one of a screen printing process and a sputtering coating process.
[0070] S3. On the upper surface of the substrate 1, a resistive layer 2 is prepared.
[0071] S4. In the middle of the upper surface of the resistance layer 2, a protective layer 3 is prepared. Specifically, the protection layer 3 is formed on the resistance layer 2 through a sputtering coating process.
[0072] S5. On both ends of the resistance layer 2, surface and back overlapping layers 5 are respectively prepared, and one end of each surface and back overlappi...
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