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Damping material and preparation method thereof as well as loudspeaker enclosure to which damping material is applied

A technology of sound-absorbing materials and molecular sieves, applied in the field of sound-absorbing materials, can solve the problems of low stability of speaker performance, degradation of speaker performance, and easy adsorption of organic matter, etc., and achieve the effect of improving low-frequency acoustic performance, improving low-frequency effect, and not easy to absorb water

Inactive Publication Date: 2018-12-11
AAC TECH NANJING
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0004] However, ordinary molecular sieves are easy to absorb moisture in the air at room temperature and occupy the micropores, resulting in a decrease in speaker performance; and it is easy to absorb organic matter, making the molecular sieve invalid, resulting in low performance stability of the speaker

Method used

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  • Damping material and preparation method thereof as well as loudspeaker enclosure to which damping material is applied
  • Damping material and preparation method thereof as well as loudspeaker enclosure to which damping material is applied
  • Damping material and preparation method thereof as well as loudspeaker enclosure to which damping material is applied

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preparation example Construction

[0033] The present invention also provides the preparation method of the above-mentioned sound-absorbing material, the specific process is as follows figure 1 shown.

[0034] Step S1: using a silicon source, an alkali source, a template agent, a gallium source and hydration to synthesize a molecular sieve with an MFI structure in which the atomic molar ratio of silicon to gallium is between 100 and 600.

[0035] In this step, when the effect is preferred, a molecular sieve with an MFI structure with an atomic molar ratio of silicon / gallium between 150 and 550 is synthesized; more preferably, a molecular sieve with an MFI structure between 220 and 480 is synthesized.

[0036]Regarding step S1, specifically, the synthesis raw materials (silicon source, gallium source, template agent, alkali source, etc.) are added to the synthesis reaction kettle, and then the MFI structure molecular sieve powder is obtained through crystallization reaction. The crystallization reaction is gene...

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Abstract

The embodiment of the invention relates to the technical field of damping materials, and discloses a damping material. The damping material comprises a molecular sieve with an MFI structure, the molecular sieve with the MFI structure comprises a framework, the framework comprises SiO2 and Ga2O3, and in the framework, the Si / Ga atomic mole ratio ranges from 100 to 600. The invention further provides a preparation method of the damping material and a loudspeaker enclosure to which the damping material is applied. According to the damping material and the preparation method thereof as well as theloudspeaker enclosure to which the damping material is applied, the loudspeaker enclosure performance can be further improved, the molecular sieve failure can be reduced, and the performance stability of the loudspeaker enclosure can be improved.

Description

【Technical field】 [0001] The embodiments of the present invention relate to the technical field of sound-absorbing materials, in particular to a sound-absorbing material, a preparation method thereof, and a speaker box using the sound-absorbing material. 【Background technique】 [0002] With the development of science and technology and the improvement of living standards, people have higher and higher requirements for the performance of speaker boxes. Especially, for the speaker box of a mobile phone, it is required to provide excellent acoustic performance while keeping the volume as small as possible. The sound quality of the speaker box is closely related to the design and manufacturing process, especially the size design of the rear cavity of the speaker box. Usually, the smaller the back cavity of the speaker box, the worse the acoustic response in the low frequency band, and the worse the acoustic performance such as sound quality, so it is necessary to try to expand ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C01B39/40C01B39/02H04R1/28
CPCH04R1/2811C01B39/026C01B39/40C01P2002/72C01B39/04C01B39/082G10K11/162C01P2002/52C01P2004/30C01P2004/64H04R1/02
Inventor 唐琨冯宏枢王和志黄国创戴际强
Owner AAC TECH NANJING
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