Structure for preventing LED conductive adhesive from loosening during soldering or use

Abstract

The invention discloses a structure for preventing LED conductive adhesive from loosening during soldering or use and relates to the field of LED manufacturing. The structure is characterized by comprising a bracket bowl cup, a cup bottom wire, the conductive adhesive, an LED wafer, a wire and packaging adhesive. At present, for preventing a substrate in a silver layer from affecting use of an LEDdue to oxidation, many manufacturers increase the anti-silver oxidant on the silver layer on a surface of a solid crystal region plate through the existing electroplating technology, however, the anti-silver oxidant solidifies when the anti-silver oxidant does not completely volatilize before the LED is produced, which causes chemical substances in the conductive adhesive to react with the anti-silver oxidant, in the subsequent high-temperature process or daily use, a problem that the LED wafer can not continue to work due to the conductive adhesive loosening away from the solid crystal region plate occurs. For solving the problem, a medium capable of connecting the conductive adhesive and the solid crystal region plate and realizing conduction is added between the conductive adhesive andthe solid crystal region plate, even if the LED wafer is disengaged from the solid crystal region plate due to the lack of adhesion of the conductive adhesive, such a problem of an open dead lamp does not occur.

Description

technical field [0001] The invention belongs to the field of LED manufacturing, and in particular relates to a structure for preventing the LED conductive glue from loosening during welding or use. Background technique [0002] Light-emitting diode (LIGHT EMITING DIODE, referred to as LED), is a semiconductor solid light-emitting device. It uses a solid semiconductor chip as a light-emitting material. When a forward voltage is applied to both ends, the minority interceptors and majority interceptors in the semiconductor recombine , release excess energy to cause photon emission, and directly emit red, orange, yellow, green, cyan, blue, purple light. Due to the advantages of high energy saving, long life, and environmental protection, LED light sources have become more and more widely used. The advantages of environmental protection and energy saving make LEDs be regarded as one of the main lighting sources in the 21st century. [0003] Due to environmental protection and co...

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Problems solved by technology

[0003] Due to environmental protection and cost constraints in the LED manufacturing process, the amount of silver layer used in the current LED bracket is gradually reduced during electroplating to make it thinner and thinner. In order to prevent the substrate in the silver layer from being affected by oxidation For LED use, in the existing electroplating technology, an anti-silver oxidant will be added to the silver layer on the surface of the crystal-bonding area, but the anti-silver oxidizer will solidify the crystal when the LED is not completely volatilized before production, which will cause chemical substances in the conductive adhesive It reacts with the anti-silver oxidant, and the result is that the adhesive force of the conductive adhesive is lost. In the subsequent high-temperature process or during daily use, the LED chip will be unable to continue to work due to the loosening of the conductive adhesive from the die-bonding area. This is a cost issue for production and a quality issue for users

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