Double-side exposure machine and double-side exposure method

Abstract

The invention relates to a double-side exposure machine and a double-side exposure method. The double-side exposure machine comprises: a mounting frame; first and second exposure components arranged oppositely and capable of moving along the mounting frame; first and second stages capable of moving along the mounting frame. The double-side exposure method is applied to the double-side exposure machine. The first exposure component and the second exposure component form a first exposure zone in a first moving state; the first stage moves in the first exposure zone and performs exposure on a first part to be exposed; the second stage carries a second part to be exposed and forms a second exposure zone when in second moving state; the second stage moves in the second exposure zone and performs exposure on the second part to be exposed, and meanwhile, the first stage unloads or loads a next first part to be exposed; front and back exposure can be achieved with no need for reversing, and inaddition, the time of an exposure process is fully utilized, exposure efficiency is improved, and automatic operation can be achieved.

Description

technical field [0001] The invention relates to the technical field of double-side exposure, in particular to a double-side exposure machine and a double-side exposure method. Background technique [0002] Traditional double-sided exposure machines usually use film transfer printing to expose double-sided circuit boards. Before exposure, it is necessary to make the film with the pattern to be transferred; then, fix the film with the pattern on both sides on the upper and lower glass respectively; then, sandwich the circuit board with the pattern to be transferred between the upper and lower glass, use The blue-violet high-brightness light source is used for exposure, and the circuit pattern is transferred to the circuit board to complete the double-sided exposure. For laser direct writing exposure machines, single-side exposure is usually used. Firstly expose one side of the circuit board, turn it over after the exposure is completed, then expose the other side of the circ...

AI Technical Summary

Problems solved by technology

[0003] However, when the laser direct writing exposure machine performs double-sided exposure, it needs to perform flipping operation, and the flipping operation will inevitably cause the problem of alignment after flipping, which not only increases the exposure process, but also affects the exposure accuracy due to the alignment accuracy problem. thus affecting the final exposure effect

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