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Higher-order high-density circuit board copper plating technology

A high-order high-density, circuit board technology, used in printed circuits, printed circuit manufacturing, electrical components, etc., can solve problems such as increased cost and decreased plating liquid level, and achieves high copper plating quality and saves etching costs.

Inactive Publication Date: 2018-11-16
SICHUAN HAIYING ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the workers salvage the circuit board from the tank, the surface of the circuit board is attached with electroplating solution, and the electroplating solution is transported to the subsequent cleaning process along with the circuit board, causing the level of the electroplating solution in the tank to drop. At this time, it is necessary to replenish the new plating solution, resulting in an increase in cost

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] Embodiment one: a kind of technique of high-order high-density circuit board copper plating, it comprises the following steps:

[0017] S1, preparation of plating solution: the content of each component contained in the plating solution per liter is: sulfuric acid: 100g; copper sulfate: 30g; the balance is deionized water, mixed, stirred evenly, and placed in the plating tank for standby ;

[0018] S2, pre-plating treatment, which specifically includes the following steps:

[0019] S21, deburring: remove the burrs on the circuit board to be plated;

[0020] S22. Decontamination: Put the surface of the circuit board to be plated into the cleaning solution in the ultrasonic cleaning machine for cleaning. The cleaning time is 5 minutes. During the cleaning solution, it is first cleaned with weak alkali, then rinsed, and then rinsed with clean water. Make sure that the oil stains are thoroughly cleaned;

[0021] S23. Drying: Put the circuit board to be plated into the dr...

Embodiment 2

[0026] Embodiment two: a kind of process of high-order high-density circuit board copper plating, it comprises the following steps:

[0027] S1, preparation of plating solution: the content of each component contained in the plating solution per liter is: sulfuric acid: 200g; copper sulfate: 35g; the balance is deionized water, mixed, stirred evenly, and placed in the plating tank for standby ;

[0028] S2, pre-plating treatment, which specifically includes the following steps:

[0029] S21, deburring: remove the burrs on the circuit board to be plated;

[0030] S22. Decontamination: put the surface of the circuit board to be plated into the cleaning solution in the ultrasonic cleaning machine for cleaning. The cleaning time is 15 minutes. During the cleaning solution, it is first cleaned with weak alkali, then rinsed, and then rinsed with clean water Make sure that the oil stains are thoroughly cleaned;

[0031] S23. Drying: Put the circuit board to be plated into the drye...

Embodiment 3

[0036] Embodiment three: a kind of process of high-order high-density circuit board copper plating, it comprises the following steps:

[0037] S1. Preparation of plating solution: the content of each component contained in each liter of the plating solution is: sulfuric acid: 240g; copper sulfate: 40g; the balance is deionized water, mixed, stirred evenly, and placed in the plating tank for later use ;

[0038] S2, pre-plating treatment, which specifically includes the following steps:

[0039] S21, deburring: remove the burrs on the circuit board to be plated;

[0040] S22. Decontamination: Put the surface of the circuit board to be plated into the cleaning solution in the ultrasonic cleaning machine for cleaning. The cleaning time is 20 minutes. During the cleaning solution process, it is first cleaned with weak alkali, then rinsed, and then rinsed with clean water. Make sure that the oil stains are thoroughly cleaned;

[0041] S23. Drying: Put the circuit board to be pla...

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PUM

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Abstract

The invention discloses a higher-order high-density circuit board copper plating technology. According to a step of copper plating, a to-be-plated circuit board is placed in a coating bath, the temperature in the coating bath is controlled between 30-40 DEG C, the electroplating current is 1.2A / dm<2>-3A / dm<2>, and the electroplating time is 10-20 min; after the step of copper plating is completed,a blower fan blows a plating solution attach to the surface of the circuit board, the plating solution falls to the coating bath, and the plating solution is saved, after the above step, a brighteneris sprayed at the surface of the circuit board by workers, so that the surface of the circuit board is smooth and clean, and during a brightener sprinkling process, the surface of the circuit board is uniformly smeared with the brightener. The higher-order high-density circuit board copper plating technology has the beneficial effects that the etching cost is saved, the plating solution is recycled, and the copper plating quality is high.

Description

technical field [0001] The invention relates to a copper plating process for a high-order high-density circuit board. Background technique [0002] High-level high-density interconnection circuit boards are formed by alternately laminating and hot-pressing multiple substrates and adhesive material layers formed with lines, and then using drilling and metallization processes in the holes to achieve the connection conduction between the lines of each layer. communication function. The circuit layer on the substrate is etched by the electroplating solution. Before etching, the parts that do not need to be etched are pasted with adhesive tape, and then the circuit board is placed in a tank filled with the electroplating solution for etching. The copper material covered by the tape, when the tape is removed, the required circuit layer can be obtained. However, when the workers salvage the circuit board from the tank, the surface of the circuit board is attached with electroplat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/38C25D5/34C25D5/52H05K3/18
CPCC25D3/38C25D5/34C25D5/52H05K3/188
Inventor 卢小燕
Owner SICHUAN HAIYING ELECTRONICS TECH
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