Liquid cooing plate provided with channels

Abstract

A liquid cooing plate provided with channels comprises a cover plate, a second body and a first body which are fixedly connected in sequence from top to bottom, wherein the first body is platy, and aplurality of slots are formed in parallel at equal interval in the upper surface of the first body; the tops of the slots are lower than the upper surface of the first body in the horizontal direction; a slot panel heat pipe is formed between the upper surface of the first body in the horizontal direction and the slots and comprises the slots and a steam cavity; the second body is platy, and the lower surface of the second body is fixedly connected with the edge of the upper surface of the first body; a plurality of parallel channels are formed in the upper surface of the second body; a waterinlet channel is formed in one ends of the channels and perpendicular to the channels, a water outlet channel is formed in the other ends of the channels and perpendicular to the channels, and the water inlet channel and the water outlet channel are communicated with the channels; the cover plate is fixedly arranged on the upper surface of the second body and totally covers the second body. By designing two layers of heat conducting bodies, heat conduction efficiency and heat dissipation capacity are improved greatly.

Description

technical field [0001] The invention belongs to the technical field of machinery and electronics, and in particular relates to a liquid cooling plate with channels. Background technique [0002] With the advancement of science and technology, electronic components are developing in the direction of miniaturization, miniaturization, and high power density. Especially with the continuous development of microelectronics technology, the power density of highly integrated high-performance devices has risen sharply, and the heat generation and heat flux density of electronic devices per unit volume have increased significantly. If the heat generated by these devices is not taken away in time, the internal temperature of the device will rise sharply. Research on the reliability of electronic components shows that as the temperature increases, the failure rate of components increases exponentially, resulting in a significant decrease in reliability. Therefore, the ensuing cooling a...

AI Technical Summary

Problems solved by technology

If the heat generated by these devices is not taken away in time, the internal temperature of the device will rise sharply.

Research on the reliability of electronic components shows that with the increase of temperature, the failure rate of components increases exponentially, resulting in a significant decrease in reliability. Therefore, the ensuing cooling and heat dissipation problem has become a hot issue in the microelectronics and heat transfer fields.

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