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Linear laser phase-shift interference triangular micro-displacement measuring device and method

A phase-shifting interference and measurement device technology, applied in the field of ultra-precision measurement, can solve problems such as low work efficiency, complex structure, and limited application range, and achieve the effects of improving measurement efficiency, signal-to-noise ratio, and lateral resolution

Active Publication Date: 2018-10-19
HARBIN INST OF TECH
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Problems solved by technology

This method can expand the measurement range and has high measurement accuracy, but its structure is complex and the work efficiency is low. The system also needs the assistance of a precise piezoelectric ceramic displacement device to complete high-resolution and large-range measurement, which greatly limits its application range.

Method used

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  • Linear laser phase-shift interference triangular micro-displacement measuring device and method
  • Linear laser phase-shift interference triangular micro-displacement measuring device and method
  • Linear laser phase-shift interference triangular micro-displacement measuring device and method

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Embodiment Construction

[0047] as attached figure 1 As shown, the example of the present invention provides a laser interference triangulation micro-displacement measurement device and method.

[0048] The device and method for measuring displacement by phase-shifting interference triangulation of the present invention include a laser (1), a shaping beam expander (2), a 1 / 2 wave plate (3), a polarizing beam splitter (4), and a first 1 / 4 wave plate (5), the first cylindrical mirror (6), the measured object surface (7), the second 1 / 4 wave plate (8), the second cylindrical mirror (9), the reference surface (10), the imaging lens ( 11), the first CCD (12), the third 1 / 4 wave plate (13), the two-dimensional Ronchi grating (14), the four-quadrant analyzer group (15), the third cylindrical mirror (16), the second CCD (17).

[0049] Wherein the laser (1), the shaping beam expander (2), and the 1 / 2 wave plate (3) form the polarized line light source part.

[0050] Among them, the line laser phase-shiftin...

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Abstract

A linear laser phase-shift interference triangular micro-displacement measuring device and method belong to the technical field of ultra-precision measurement. According to the invention, a phase-shift interference technology and a laser triangulation technology are combined to realize wide-range and high-precision micro-displacement measurement. According to the phase-shift interference principleand the laser triangulation principle, a light source output is changed into a linear parallel beam by adopting shape beam expansion, and four linear interference beams with 90-degree phase shifts insequence are obtained synchronously by grating beam splitting and a four-quadrant analyzer group. Meanwhile, a linear laser triangulation system obtains rough displacement measurement data by partialdiffuse reflection light. When the maximum error of linear laser triangulation measurement is less than 1 / 4 of an interference signal period, an accurate displacement value can be obtained by certainsolution. The measuring accuracy is high, the measuring range is wide, linear scan measuring can be realized, and the measuring device and method are suitable for measuring the step height, the filmthickness, the displacement / position of a moving part and the like in a microstructure device.

Description

technical field [0001] The invention relates to a line laser phase-shifting interference triangular micro-displacement measuring device and method, belonging to the field of ultra-precision measurement, and mainly relates to the application of ultra-precision non-contact rapid measurement of geometric characteristic dimensions of microstructure devices. Background technique [0002] With the continuous development of processing and manufacturing technology, the demand for micro-displacement non-contact sensors with high precision and large range continues to increase. For example, in lithography technology, various geometric parameters in silicon wafer etching are important factors affecting device quality and yield, measurement and verification of line width, spacing, step height, film thickness, etc. in chips and masks, and The unification and traceability of these geometric dimensions have become particularly important in the processing and manufacturing of integrated cir...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01B11/02G01B9/02G01D5/353
CPCG01B9/02083G01B11/02G01D5/35306
Inventor 黄向东谭久彬
Owner HARBIN INST OF TECH
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