Flexible cuprous oxide film, and preparation method and applications thereof

A cuprous oxide, thin film technology, applied in copper oxide/copper hydroxide, nanotechnology for materials and surface science, nanotechnology, etc.

Inactive Publication Date: 2018-09-28
FUDAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Inorganic materials are generally more stable b

Method used

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  • Flexible cuprous oxide film, and preparation method and applications thereof
  • Flexible cuprous oxide film, and preparation method and applications thereof
  • Flexible cuprous oxide film, and preparation method and applications thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Embodiment 1 (film preparation method)

[0025] Deposit a 60 nm thick copper film on a pre-cleaned PET plastic substrate, immerse the copper film in a 1 mmol / L ammonium thiocyanate aqueous solution, react for 2 hours, and clean it with deionized water, that is, on the PET plastic substrate A cuprous thiocyanate film was formed on it. Immerse the cuprous thiocyanate film in 0.01 mol / liter sodium hydroxide aqueous solution, take it out after reacting for 1 hour, at this time the cuprous thiocyanate has completely transformed into a light yellow cuprous oxide film, rinse with deionized water, dry, That is, a cuprous oxide film is formed on a PET plastic substrate. Save for later.

[0026] The method of the invention can prepare a large-area thin film.

[0027] figure 1 The preparation of cuprous oxide thin films on plastic substrates is described.

[0028] SEM images show that the cuprous oxide film is composed of randomly distributed and uniform network nanowires. Mo...

Embodiment 2

[0031] Bending and half-folding tests on cuprous oxide film samples on PET plastic substrates:

[0032] Sample 1: The film was repeatedly bent about 5,000 times with a bending radius of about 1.5 mm, and fixed into a curved shape (with a radius of curvature of about 1.5 mm), fixed on a small round table with double-sided adhesive tape for SEM observation.

[0033] Sample 2: Fold the film in half at 180°, flatten it with force to form creases, fix it on a small round table, and use SEM to observe the morphology and microstructure of the crease area.

[0034] figure 2 are schematic diagrams and typical SEM images of two samples. After the nanowire film is formed, the apparent thickness is much larger than that of the copper film, which can reach hundreds of nanometers.

[0035] Sample 1 (left) has undergone repeated bending, which is equivalent to repeated stretching and compression of the film (especially the nanowires on the upper surface) under the support of the substrate...

Embodiment 3

[0038] Corrosion resistance, organic solvent resistance, hot water resistance and other performance tests of cuprous oxide film samples:

[0039] The cuprous oxide film samples (including plastic substrates) were placed in deionized water, 0.1 mol / liter sodium chloride solution, acetone, and N,N-dimethylformamide (DMF) for two months; The same sample was boiled in boiling water for 1 hour.

[0040] From the appearance, the film did not appear to fall off, such as image 3 shown. Soaking in acetone solution for a long time has some influence on the color of the film, which may be due to the photocatalytic performance of cuprous oxide, which changes the organic molecular structure and makes itself dyed; the color is somewhat uneven after boiling in boiling water for 1 hour, which may be due to high temperature In the lower atmospheric environment, some cuprous ions are oxidized to divalent cupric ions, and the hydrate of divalent cupric ions makes a small amount of blue-green ...

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Abstract

The invention belongs to the technical field of functional film, and more specifically relates to a flexible cuprous oxide film, and a preparation method and applications thereof. According to the preparation method, cuprous thiocyanate film is taken as a precursor, immersion treatment in an alkaline solution is adopted, chemical reaction in-suit preparation is adopted so as to obtain the flexiblecuprous oxide film. The preparation method comprises following specific steps: precipitation of copper film on a flexible substrate is carried out firstly; the copper film is immersed in a thiocyanate solution, and chemical reaction is adopted so as to form the cuprous thiocyanate film on the plastic substrate; the cuprous thiocyanate film is immersed in an alkaline solution for reaction so as toobtain the cuprous oxide nano wire film formed through in-suit formation on the plastic substrate. The flexible cuprous oxide film is convenient for large area large scale production, possesses bending resistance, is foldable, and is stable in the structure and performance. The flexible inorganic semiconductor film is high in application value in the fields of flexible functional material and flexible device.

Description

technical field [0001] The invention belongs to the technical field of functional thin films, and in particular relates to a flexible and bendable cuprous oxide thin film and its preparation method and application. Background technique [0002] Cuprous oxide (Cu 2 O) is a low-cost semiconductor material, which has a wide range of applications in photocatalysis, sensors, supercapacitors, lithium-ion batteries, and many other fields. Cuprous oxide is a very competitive solar cell material due to its band gap of 2.17 eV. [0003] Inorganic materials are generally more stable but brittle compared to organic and polymeric materials. Brittleness is a common feature of inorganic materials, and it is one of the goals that people have been working hard to develop inorganic materials that are bendable and tough. With the development of wearable electronics, especially stretchable electronic materials, the development of flexible inorganic semiconductor materials has attracted more ...

Claims

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Application Information

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IPC IPC(8): C01G3/02B82Y30/00B82Y40/00
CPCB82Y30/00B82Y40/00C01G3/02C01P2004/03C01P2004/16C01P2004/64
Inventor 徐伟夏鹏
Owner FUDAN UNIV
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