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Cyanide-free alkaline copper plating process capable of recovering waste liquid

An alkali copper and process technology, applied in the field of cyanide-free alkali copper copper plating process, can solve the problems of inability to collect waste liquid, high cost, poor copper plating effect, etc., and achieve convenient maintenance, good bonding force, and good copper plating effect. Effect

Inactive Publication Date: 2018-09-21
东莞市永晟环保技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The object of the present invention is to provide a kind of cyanide-free alkali copper plating process of recyclable waste liquid, to solve the problem that the waste liquid produced after copper plating cannot be collected in the above-mentioned background technology; the copper plating effect is not good, and the cost is too high question

Method used

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Embodiment Construction

[0014] The technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0015] The invention provides a technical solution: a cyanide-free alkali copper plating process of recyclable waste liquid, including the preparation of a potting agent, adjusting the pH value, heating up the plating solution and electroplating. The process includes first adding volume Water with a proportion of at least 50%, and then according to the proportion of raw materials, prepare a pot opener. The pot opener is 200-410mL / L cyanide-free alkaline copper plating pot opener, mainly composed of copper salt and complexing agent ,...

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PUM

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Abstract

The invention discloses a cyanide-free alkaline copper plating process capable of recovering waste liquid. The cyanide-free alkaline copper plating process comprises the steps of preparing a plating agent, adjusting pH value, heating a plating solution and electroplating. The cyanide-free alkaline copper plating process comprises the steps that water with a volume ratio of at least 50% is added into a plating bath, preparing of is the plating agent is carried out according to the raw material composition ratio, the plating agent is added into the plating bath, water is added to dissolve and adjust the pH value of the plating solution, the plating bath is heated, the plating solution is heated, energizing and plating are carried out, and the plating solution is continuously filtered. According to the cyanide-free alkaline copper plating process capable of recovering the waste liquid, through creative improvement of the raw material ratio and the process flow, the copper plating processcan better process materials and has better copper plating effect, and is suitable for any metal substrate such as pure copper, copper alloy, iron, stainless steel, zinc alloy die castings, aluminum and aluminum alloy workpieces. At the same time, the waste liquid produced after copper plating can be collected, more energy conservation and environment prevention are achieved, the copper plating effect is better, the cost required by the copper plating process is effectively reduced, and the cyanide-free alkaline copper plating process is suitable for promotion in the market.

Description

technical field [0001] The invention relates to the technical field of cyanide-free alkali copper plating, in particular to a cyanide-free alkali copper plating process in which waste liquid can be recovered. Background technique [0002] Cyanide copper plating is the earliest and most widely used copper plating process. The plating solution is mainly composed of copper cyanide complex and a certain amount of free cyanide, which is strongly alkaline. Because cyanide has a strong activation and complexing ability, the first feature of this electroplating method is that the solution has a certain degreasing and activation ability. With the continuous progress of science and technology and copper plating process, the existing copper plating methods are also constantly improving. The cyanide-free alkali copper plating process is the embodiment of the progress of copper plating process, but the existing copper plating process, especially It is the shortcoming that the cyanide-f...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/38C25D21/06
CPCC25D3/38C25D21/06
Inventor 李臣汪怀春杨德成
Owner 东莞市永晟环保技术有限公司
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