Nickle-coated copper micrometer sheet of core-shell structure and preparation method and application thereof

Abstract

The invention provides a nickle-coated copper micrometer sheet of a core-shell structure and a preparation method and application thereof. The method comprises the steps that ethylene glycol and a micrometer copper sheet are mixed, and a reducing agent and nickle salt are added for reaction to obtain the nickle-coated copper micrometer sheet of the core-shell structure, wherein the mass ratio of the micrometer copper sheet to the nickle salt is (7-8) to (1-1).1. According to the method, the ethylene glycol is used as a solvent, and the ethylene glycol can reduce ion diffusion, so that the reaction dynamics are controlled, and a layer of continuous and compact nickle is obtained on the surface of the micrometer copper sheet through electroless deposition; due to a self-limiting growing effect, the nickle layer does not overgrow, the thickness is well controlled, nickle-coated copper still retains the sheet-like morphology with the original high length-width ratio, the original sheet-like structure with the high length-width ratio remains, the nickle-coated copper micrometer sheet of the core-shell structure is obtained, and under protection of nickle, the copper sheet has high oxidation resistance; the nickle layer is compact and thin, so that the nickle-coated copper micrometer sheet has excellent conductivity and thermal stability; the nickle-coated copper micrometer sheet hasgood application prospects in preparation of conductive filler or electromagnetic shielding materials or heat conduction materials.

Description

technical field [0001] The invention belongs to the technical field of nickel-copper-clad micro-sheets, and in particular relates to a nickel-coated copper micro-sheet with a core-shell structure, a preparation method and an application thereof. Background technique [0002] Copper has an electrical conductivity comparable to silver (silver: 6.301×10 7 S m -1 ; Copper: 5.9×10 7 S m -1 ), and the content of copper in nature is 1000 times higher than that of silver, and the cost is only 1% of silver. However, the chemical properties of copper are more active than silver, especially the micronano-scale flake copper, which tends to combine with other atoms, has poor stability, and will be quickly oxidized in the air, so it is difficult to be widely used like micron silver flakes (elastic conductor filler or paint filler, etc.). [0003] From page 834 of volume 16 of "Natural Materials" in 2017, a printable elastic conductor with silver microflakes as conductive filler was r...

AI Technical Summary

Problems solved by technology

[0010] To sum up, the current copper powder nickel plating mainly has the following difficulties: (1) There are few methods for copper microflakes; (2) The nickel content in the composite powder is too high, and there is no clear micro-nano structure; (3) The composition of the solution used in the reaction process is complex and difficult to control

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