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LED lighting panel

A technology for LED lighting and LED chips, applied in electrical components, electrical solid devices, circuits, etc., can solve the problems of inability to adjust and change series and parallel, difficult to find LED chips, etc., to achieve flexible wiring, good conductivity, and avoid overflow. Effect

Active Publication Date: 2018-09-07
常州市万象灯业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example attached figure 1 A plurality of LED chips 2 are mounted on an insulating substrate 1, and the LED chips 2 are flip-chip mounted on a circuit pattern (not shown) on the insulating substrate 1 via solder balls 3, and finally sealed via an encapsulating resin 4. The surface of this package The light source needs to form a circuit pattern on the insulating substrate 1 in advance. After the circuit pattern is encapsulated, the series and parallel connection cannot be adjusted and changed. In addition, after a certain LED chip fails, it is difficult to find the failed LED chip.

Method used

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Examples

Experimental program
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no. 1 example

[0032] see figure 2 , the LED lighting panel of the present invention, it comprises:

[0033] an insulating substrate 11 having opposite first and second surfaces and a plurality of through holes 15 penetrating through the first and second surfaces;

[0034] The adhesive layer 16 is disposed on the first surface and has a plurality of grooves 19 corresponding to the plurality of through holes 15, and the plurality of grooves 19 are respectively connected to the plurality of through holes 15 Pass;

[0035] A plurality of LED chips 12, adhered to the adhesive layer 16, and have a plurality of electrode pads 13, the plurality of electrode pads 13 respectively correspond to the plurality of grooves 19 and in the plurality of grooves exposed in the groove 19;

[0036] encapsulating resin 14, disposed on the plurality of LED chips 12 and the bonding layer 16;

[0037] Conductive paste 20, filling the plurality of through holes 15 and the plurality of grooves 19;

[0038] The c...

no. 2 example

[0041] refer to image 3 , the present invention also provides another LED lighting panel, which includes:

[0042] an insulating substrate 11 having opposite first and second surfaces and a plurality of through holes 15 penetrating the first and second surfaces, and having a thickness of d1;

[0043] The adhesive layer 16 has a thickness of d2, is arranged on the first surface, and has a plurality of grooves 19 corresponding to the plurality of through holes 15, and the plurality of grooves 19 are connected to the plurality of through holes 15. The through holes 15 are respectively connected to each other;

[0044] A plurality of LED chips 12, adhered to the adhesive layer 16, and have a plurality of electrode pads 13, the plurality of electrode pads 13 respectively correspond to the plurality of grooves 19 and in the plurality of grooves exposed in the groove 19;

[0045] encapsulating resin 14, disposed on the plurality of LED chips 12 and the bonding layer 16;

[0046]...

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Abstract

The invention provides an LED lighting panel. Conductive paste is filled in one step using grooves and through holes to extract a circuit pattern from the lower surface of an insulating substrate, wherein the circuit pattern can realize flexible wiring, which is more advantageous for finding a failing LED chip because multiple through holes can be detected; copper pins can avoid the overflow of the conductive paste, reduce the use of the conductive paste, and provide better conductivity; in addition, the flipping method of the LED does not require solder balls or wire bonding, and the LED is directly bonded to a bonding layer, so that the LED lighting panel is thinner and prevents side light emission.

Description

technical field [0001] The invention relates to the field of LED package manufacturing, in particular to an LED lighting panel. Background technique [0002] Most of the existing LED packages are in the form of COB, which utilizes circuit patterns on an insulating substrate to realize series-parallel connection of LEDs. For example attached figure 1 A plurality of LED chips 2 are mounted on an insulating substrate 1, and the LED chips 2 are flip-chip mounted on a circuit pattern (not shown) on the insulating substrate 1 via solder balls 3, and finally sealed via an encapsulating resin 4. The surface of this package The light source needs to form a circuit pattern on the insulating substrate 1 in advance. After the circuit pattern is encapsulated, the series and parallel connection cannot be adjusted and changed. In addition, after a certain LED chip fails, it is difficult to find the failed LED chip. Contents of the invention [0003] Based on solving the above problems,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/62H01L25/075
CPCH01L25/0753H01L33/486H01L33/62H01L2933/0033H01L2933/0066
Inventor 庄明磊
Owner 常州市万象灯业有限公司
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