Diamond wire cutting machine

Abstract

The invention discloses a diamond wire cutting machine. The diamond wire cutting machine comprises a base, a machine frame, a workpiece clamping device, a cutting line component and a lifting mechanism, wherein the machine frame and the workpiece clamping device are arranged on the base, the cutting line of the cutting line assembly performs linear cutting on the workpiece on the workpiece clamping device, and the lifting mechanism is used for adjusting the distance between the cutting line and the workpiece; and the cutting line assembly comprises two take-up and pay-off wheels, the take-up and pay-off wheel drives the take-up and pay-off line through torque motors to cut the workpiece. According to the machine, the bidirectional take-up and pay-off line is realized through two torque motors, the tension of the cutting line between the two take-up and pay-off wheels is ensured to be constant through the output constant torque; the manufacturing cost of equipment is saved, the linear speed of the cutting line is guaranteed to be stable while the bidirectional constant-tension control of the torque motor can guarantee the tension of the cutting line, so that the cutting quality is improved; and during in long-line cutting, one take-up and pay-off wheel is empty, and the linear speed of another take-up and pay-off wheel with full storage is consistent, so that the broken line caused by the speed difference is prevented, and the high-speed and stable operation of the cutting line is guaranteed.

Description

technical field [0001] The invention belongs to the technical field of cutting equipment, in particular to a diamond wire cutting machine for cutting hard and brittle materials such as silicon rods. Background technique [0002] At present, wire saws are often used to cut hard and brittle materials such as silicon rods. Wire saw cutting technology has the advantages of narrow kerf, high efficiency, good slice quality, and curve cutting. In the prior art, wire cutting equipment for silicon rods has the forms of single wire cutting equipment and wire mesh cutting equipment. Wire mesh cutting equipment is often used for silicon wafer cutting, which has high equipment costs and strict control requirements. And silicon rod cutting often adopts single wire cutting. The tension control of wire cutting directly affects the efficiency and quality of cutting. Excessive tension or tension fluctuations will cause the cutting wire to break and the cutting surface of the cutting workp...

AI Technical Summary

Problems solved by technology

However, in order to ensure the cutting tension and cutting line speed, the power of the servo motor needs to be relatively large, which greatly increases the manufacturing cost of the equipment

And the tension control of the servo motor is usually set at the take-up wheel, which is a one-way control. In order to ensure a constant tension, it is controlled by adjusting the speed of the take-up, which causes the line speed of the cutting line to be inconsistent, thus affecting the cutting quality.

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