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Butt-welding equipment for sheet material and wafer

A wafer and butt welding technology, which is applied in the field of smart cards, can solve the problems such as the complexity of the wafer and sheet metal butt welding process, and achieve the effect of reducing the process

Pending Publication Date: 2018-09-04
SHENZHEN YUANMINGJIE TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The main purpose of the present invention is to propose sheet material and wafer butt welding equipment, aiming to solve the problem of complicated wafer and sheet material butt welding process in the prior art

Method used

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  • Butt-welding equipment for sheet material and wafer
  • Butt-welding equipment for sheet material and wafer
  • Butt-welding equipment for sheet material and wafer

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Embodiment Construction

[0026] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0027] It should be noted that if there is a directional indication (such as up, down, left, right, front, back, horizontal, vertical...) in the embodiment of the present invention, the directional indication is only used to explain the position in a certain posture ( As shown in the accompanying drawings), if the specific posture changes, the directional indication will also change accordingly.

[0028] In addition, if there are descriptions involvin...

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Abstract

The invention discloses butt-welding equipment for a sheet material and a wafer. The butt-welding equipment for the sheet material and the wafer comprises a wafer placing module, a butt-welding moduleand a wafer carrying module, wherein the wafer placing module comprises a first position detection component used for detecting the position of a wafer on the wafer film; the butt-welding module comprises a welding table used for placing the wafer; the wafer carrying module comprises a picking-up piece moving between the wafer placing module and the butt-welding module, the picking-up piece picksup the wafer according to the position, detected by the first position detection component, of the wafer and carries the wafer onto the welding table. In the technical scheme, the position of the wafer is detected and determined by virtue of a first detection component, the wafer is carried onto the welding table by virtue of the wafer carrying module, the sheet material and the wafer are directly welded together by virtue of the butt-welding component, and working procedures of wafer fixing, binding, gluing, IC punching, adhesive tape sticking and module packing are avoided, so that workingprocedures of processing the wafer into a module and carrying out module processing are eliminated, and the equipment for directly welding the wafer with the sheet material together is provided.

Description

technical field [0001] The invention relates to the technical field of smart cards, in particular to a sheet material and wafer butt welding equipment. Background technique [0002] With the development of high-tech, non-contact smart cards are widely used in daily life. In the smart card manufacturing industry, the traditional manufacturing process needs to pass the wafer through die bonding, bonding, dispensing, die-cutting IC, adhesive paper, module filling, etc. After installing these processes, it is cumbersome to perform butt welding with the sheet metal, and the process is cumbersome and the operation is complicated. In the prior art, the process of butt welding the wafer and the sheet metal is cumbersome and the operation is complicated, and there is no equipment for direct butt welding of the wafer and the sheet metal. It is not convenient for the production and production of smart cards. Contents of the invention [0003] The main purpose of the present inventio...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67B23K31/02B23K37/00
CPCH01L21/67144B23K31/02B23K37/00Y02P70/50
Inventor 黎理明鲍伟海黎理杰
Owner SHENZHEN YUANMINGJIE TECH
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