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Modified epoxy resin material

An epoxy resin and modification technology, applied in the field of modified epoxy resin materials, can solve the problems of insufficient curing, high brittleness, low shrinkage rate, etc., and achieve good curing effect, improve heat resistance, and overcome the effects of adhesion decline.

Inactive Publication Date: 2018-09-04
嘉兴立一新材料股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Simple resins can no longer meet the application of copper clad laminates. Even cyanate resins with better heat resistance have excellent dielectric properties (dielectric coefficient: 2.8-3.2; dielectric loss factor: 0.002-0.003), high Heat resistance (glass transition temperature: 280-295°C), and cyanate ester resin also has low shrinkage, excellent mechanical properties and bonding properties, etc., but it has not been widely used due to defects such as insufficient curing and high brittleness.

Method used

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  • Modified epoxy resin material
  • Modified epoxy resin material
  • Modified epoxy resin material

Examples

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Embodiment 1

[0024] A kind of modified epoxy resin material, its preparation method comprises the following steps:

[0025] (1) Disperse the nano-silica foam in toluene, then add vinyl propionate, tert-butyl diazoacetate and allyl aralkylphenol; stir at 110°C for 30 minutes; then add tetramethylethyl ether Diamine, disperse evenly and then add dibutylzinc dilaurate, reflux reaction for 7 hours, finally add acetone to obtain modified silica with a solid content of 40%; nano silica foam, vinyl propionate, diazo The mass ratio of tert-butyl acetate, allyl aralkylphenol, tetramethylethylenediamine, and dibutylzinc dilaurate is 1: 1: 0.5: 1.5: 0.5: 0.008; the present invention uses vinyl propionate Esters, tert-butyl diazoacetate, allyl aralkylphenol, and tetramethylethylenediamine monomers treat nano-silica foam, which weakens the reactivity of fillers and improves the dispersion of fillers in organic matter. Play a role in hot pressing curing;

[0026] (2) At room temperature, mix 3,3'-dith...

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Abstract

The invention relates to a modified epoxy resin material. A preparation method comprises the following steps of adding modified silicon dioxide into a bifunctional epoxy system; adding a monofunctional epoxy system and nanometer polytetrafluoroethylene particles to obtain glue liquid; regulating the solid content of the glue liquid to be 50 percent by propylene glycol methyl ether acetate; then, soaking glass fabric into the glue liquid; next, performing heating and drying to obtain the modified epoxy resin material. The modified epoxy resin material has excellent flame retardant performance and heat resistant performance, and particularly has excellent wear-resistant performance.

Description

technical field [0001] The invention belongs to the technical field of electronic composite materials, and in particular relates to a modified epoxy resin material. Background technique [0002] With the continuous development of science and technology, the application of polymer matrix composites is becoming more and more extensive. At the same time, various application fields also put forward higher requirements for different materials, such as high temperature resistance, ablation resistance, wear resistance, etc. With the emphasis on flame retardancy, products are required to have flame retardancy. Flame retardancy has grade requirements, which are UL94 V-2, UL94 V-1 and UL94 V-0 grades, of which UL94 V-0 grade is the existing International standard for determining whether a substance is flame retardant. Finding a balance between fire protection and environmental protection is an important node in the development of future flame retardant products. The importance of f...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L27/18C08L71/02C08K13/06C08K9/04C08K3/36C08K7/14C08J5/24C08G59/22C08G59/24C08G59/68
CPCC08G59/223C08G59/245C08G59/68C08G59/687C08G59/688C08J5/24C08J2363/00C08J2427/18C08J2471/02C08K3/36C08K7/14C08K9/04C08K13/06C08K2201/011
Inventor 王志龙韩建梁国正
Owner 嘉兴立一新材料股份有限公司
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