Three-dimensional printing method based on DLP (digital light processing) projection photocuring and equipment

Abstract

The invention discloses a three-dimensional printing method based on DLP (digital light processing) projection photocuring. The method particularly comprises the following steps of: constructing a three-dimensional model of an object in advance, directly obtaining a cross section of each slice to be printed, and performing processing, area division and normal value judgment through corresponding units. The data distortion is reduced; the forming precision of printing data of the method is improved; areas to be printed and printing equipment with different performance are reasonably adapted, sothat the forming dimension precision and fineness of the object are guaranteed; and the forming efficiency is improved. In addition, the invention further discloses printing equipment adapted to thethree-dimensional printing method based on the DLP projection photocuring.

Description

technical field [0001] The invention relates to the technical field of three-dimensional printing rapid prototyping, in particular to a method and equipment for three-dimensional printing based on DLP projection light curing. Background technique [0002] In the DLP projection light curing system, the digital chip used is usually a digital micromirror device (DMD), which has a fixed size. Only a fixed imaging format and feature resolution can be achieved through the imaging lens, which will result in an incompatibility between size and precision. For example, when using a small size for high-precision projection, it is possible to achieve a few microns in the size of the part, but this will limit the overall molding speed of the part; when using a larger size projection, it can be effectively The molding speed of the parts is guaranteed, but the fine features in the parts are seriously distorted, the imaging accuracy cannot be guaranteed, and the energy cannot be fully utili...

AI Technical Summary

Problems solved by technology

[0002] In the DLP projection light curing system, the digital chip used is usually a digital micromirror device (DMD), which has a fixed size. Only a fixed imaging format and feature resolution can be achieved through the imaging lens, which will result in an incompatibility between size and precision. For example, when using a small size for high-precision projection, it is possible to achieve a few microns in the size of the part, but this will limit the overall molding speed of the part; when using a larger size projection, it can be effectively The molding speed of the parts is guaranteed, but the fine features in the parts are seriously distorted, the imaging accuracy cannot be guaranteed, and the energy cannot be fully utilized

The methods for solving the above problems in the prior art mainly include the following two types: (1) splicing digital chip arrays, but this method is expensive, which increases the process cost, and at the same time cannot guarantee a very small splicing gap, and it is difficult to ensure the molding accuracy; (2) ) splicing imaging surface method, by dividing the imaging surface into regions and splicing exposure, but the efficiency is low

Images