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Four-phase double-percolation electromagnetic shielding material and preparation method thereof

A technology of electromagnetic shielding materials and composite materials, applied in the field of electronic packaging materials, can solve the problems of unsafe and reliable large-scale application, failure of plastic packaging parts, difficulty in meeting composite performance requirements, etc.

Active Publication Date: 2018-08-10
CHENGDU TECHCAL UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It is difficult to meet the composite performance requirements. In actual application scenarios, due to various restrictive factors, it is often difficult to fully implement and utilize such simplistic research results.
Although some reported packaging materials have good thermal conductivity, the uniformity and stability of the material are not good, and local hot spots are prone to occur, resulting in partial failure of plastic packages, and cannot be safely and reliably used in large-scale industrial applications.

Method used

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  • Four-phase double-percolation electromagnetic shielding material and preparation method thereof
  • Four-phase double-percolation electromagnetic shielding material and preparation method thereof
  • Four-phase double-percolation electromagnetic shielding material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0073] Preparation of silver-coated carbon fiber (APCF)

[0074] First, remove the weak interface layer such as slurry coated on the CF surface and adsorbed impurities: put CF in a muffle furnace and bake at 300°C for 12 minutes to remove surface organic impurities, ultrasonically clean for 30 minutes, and dry under reduced pressure for 10 minutes.

[0075] Then, put CF into NaOH solution and ultrasonically disperse for 1 h to roughen the surface of CF. Filter, rinse with water to remove residual NAOH solution, then in SnCl 2 Soak in a mixed solution with HCl for 1 h at room temperature to sensitize the surface of CF. Sn formed in solution 2 (OH) 3 Cl is adsorbed on the surface of CF, filtered with suction and washed with water.

[0076] Finally, using the mixed solution PdCl 2 、H 3 A mixed solution of BO and HCl is used to activate it, and a redox reaction occurs. After sensitization and activation treatment, Pd 2+ By Sn 2+ It is reduced to metal Pd atoms, adsorbed...

Embodiment 2

[0086] Preparation of APCF

[0087] Stepless silver plating on the surface of CF: first remove the weak interface layer such as slurry coated on the surface of CF and adsorbed impurities, put CF in a muffle furnace and bake at 320°C for 10 minutes to remove surface organic impurities, ultrasonic 20 minutes to remove attachments, wash, Vacuum dry. Then carry out CF surface treatment, put CF in NaOH solution and ultrasonically disperse for 1.5h to roughen the CF surface; then in SnCl 2 and HCl in a mixed solution at room temperature for 1 h to sensitize the surface of CF, and the Sn generated in the solution 2 (OH) 3 Cl is adsorbed on the surface of CF, filtered and washed with suction. Finally, using the mixed solution PdCl 2 , H 3 A mixed solution of BO and HCl is used to activate it, and a redox reaction occurs. After sensitization and activation treatment, Pd 2+ By Sn 2+ It is reduced to metal Pd atoms, adsorbed on the surface of CF, and becomes the catalytic activ...

Embodiment 3

[0091] CF / ABS preparation

[0092] Using the melt blending method, taking ABS as the matrix and CF as the filler, adding 0.5% polyethylene paraffin, 2% SMA, and 0.5% antioxidant 1010, the CF reinforced ABS composite material was prepared, and the microstructure of the composite material, CF The effect of the filling amount on the thermal conductivity and mechanical properties of composites. Add CF to the ABS matrix material and melt blend to make CF / ABS composite material. The added amount of CF is 5%, 10%, 15%, 20%, 25%, 30% (relative to the weight ratio of the matrix ABS raw material).

[0093] It was found that CF was more uniformly dispersed in ABS, but the distribution direction was disordered, and there was no obvious agglomeration. The thermal conductivity of the composite material is figure 2 It can be seen that when the CF loading is less than 30wt%, the thermal conductivity of the composite increases significantly with the increase of the CF filling, but no per...

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Abstract

The invention discloses an electromagnetic shielding material. The electromagnetic shielding material is prepared from the following components in parts by weight: 35 to 45 parts of ABS (AcrylonitrileButadiene Styrene), 45 to 55 parts of PA66 (Polyamide 66), 2 to 18 parts of silver-plated carbon fibers, 2 to 18 parts of EG (Expanded Graphite), 0.5 to 1 part of plasticizer, 2 to 4 parts of solubilizing agent and 0.5 to 1 part of antioxidant. The electromagnetic shielding material disclosed by the invention breaks through a traditional melting and blending technology; technological parameters for preparing a double-percolation structure, a processing sequence and an extruding technology are designed and the percolation threshold of CF is extremely reduced. The method has the advantages of high production efficiency and simplicity in operation; the material cost can be extremely reduced and large-batch industrial production is facilitated.

Description

technical field [0001] The invention relates to an electromagnetic shielding material, in particular to a four-phase double percolation electromagnetic shielding material, which belongs to the technical field of electronic packaging materials. Background technique [0002] High-performance electronic packaging materials run through multiple technical links such as design, process, and testing of electronic packaging technology, and play a vital role. Packaging technology with packaging materials and processes as the core radiates to aerospace, communications, automobiles, electronics, etc. each field. [0003] With the rapid development of electronic science and technology, there is a strong demand for upgrading of packaging technology, and the market's requirements for packaging technology will become higher and higher, and the quality of corresponding electronic packaging materials will also be higher and higher. Electronic packaging technology with increasing integration...

Claims

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Application Information

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IPC IPC(8): C08L55/02C08L77/06C08L23/06C08L91/06C08L35/06C08K13/06C08K9/10C08K7/24C08K3/04H05K9/00C09K5/14
CPCC08L55/02C08L77/06C08L2201/04C08L2203/206C08L2205/035C09K5/14H05K9/0081C08L23/06C08L91/06C08L35/06C08K13/06C08K9/10C08K7/24C08K3/046
Inventor 廖益均吴晓莉
Owner CHENGDU TECHCAL UNIV
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