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Production method of metal micro-needle array female die

A microneedle array and metal technology, applied in the directions of microneedles, needles, and pharmaceutical devices, can solve the problems of easy deformation of polymer female molds, difficult processing technology, and difficult precision control, and achieve easy mass replication and preparation. Microneedle array patch, low processing cost and stable physical properties

Active Publication Date: 2018-08-07
上海揽微医学科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] Features of the present invention: anti-bonding layer is prepared on the microneedle array male mold, a metal seed layer is prepared on it, and the microneedle array female mold is prepared by electroplating, electroless plating or electroforming. This process is different from the existing The MEMS (Micro-Electro-Mechanical Micro-Mechanical System) process is compatible, and can be precisely matched with a specific microneedle array male mold to prepare a metal microneedle array female mold, which can solve the problem that the current polymer female mold is easy to deform, has a short life, and is difficult , the problem of disinfection at high temperature can also solve the defects of the current metal female mold processing technology, which is difficult, complicated, difficult to control the precision and difficult to reduce the cost

Method used

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  • Production method of metal micro-needle array female die
  • Production method of metal micro-needle array female die
  • Production method of metal micro-needle array female die

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preparation example Construction

[0034] figure 1 It is a schematic diagram of the microneedle array male mold in the manufacturing process of the metal microneedle array female mold of the present invention; figure 2 It is a schematic diagram of the anti-adhesion layer and the metal seed layer coated on the surface of the microneedle array male mold in the metal microneedle array female mold process of the present invention; image 3 A schematic diagram of electroplating (or electroless plating or electroplating) on ​​the surface of the microneedle array male mold coated with an anti-adhesion layer and a metal seed layer; Figure 4 It is a schematic diagram of the metal layer of the female mold coated with an adhesive layer in the process of the female mold of the metal microneedle array of the present invention; Figure 5 It is an overall schematic diagram of the reinforcement layer added in the metal microneedle array female mold process of the present invention; Image 6 It is a metal microneedle array female ...

Embodiment 2

[0064] In this embodiment, the preparation method of the microneedle array male mold is MEMS (Micro Mechanical Micro Electro Mechanical System). The material is various types of silicon substrates, with a thickness of 200μm~3000μm, a microneedle diameter of 0.001μm~5000μm, and a microneedle height of 0.001μm~10,000μm. The material of this embodiment is preferably a double-polished monocrystalline silicon wafer, the microneedle diameter is 200 μm, and the microneedle height is 300 μm.

[0065] The shape of the microneedle in this embodiment is a square pointed cone. In order to ensure the density of the microneedle array, the spacing between the microneedles in this embodiment is 400 μm.

[0066] The anti-adhesion layer of this embodiment is perfluoroalkoxy resin with a thickness of 100 nm.

[0067] The material of the metal seed in this embodiment is Cr / Cu, and the thickness is 30 / 80 nm.

[0068] In this embodiment, it is preferably Cu with a thickness of 2 mm.

[0069] This embodime...

Embodiment 3

[0092] The microneedle array male mold is prepared by ultra-precision mechanical method, the material is glass, such as: quartz glass, ordinary silicate glass, etc., the diameter of the microneedle is 0.001μm~5,000μm, and the height of the microneedle is 0.001μm~10,000μm. The material example of this embodiment selects ordinary silicate peeling, etc., the microneedle diameter is 50 μm, and the microneedle height is 150 μm.

[0093] The microneedle in this embodiment is a six-sided pointed cone.

[0094] The spacing between the microneedles in this embodiment is 150 μm.

[0095] The anti-adhesive layer in this embodiment is ethylene-tetrafluoroethylene copolymer with a thickness of 80 nm.

[0096] The material of the metal seed in this embodiment is Cr / Ti, and the thickness is 30 / 50 nm.

[0097] In this embodiment, the female mold metal layer is Ni with a thickness of 0.5 mm.

[0098] In this embodiment, the adhesive layer is selected from glass glue, with a thickness of 0.3 mm.

[0099] ...

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Abstract

A production method of a metal micro-needle array female die comprises: producing an anti-bonding layer and a metal seed layer on a micro-needle array male die; covering the metal seed layer with a female die metal layer; applying a reinforcing layer to the surface of the female die metal layer; removing the male die to obtain the metal micro-needle array female die. The production method of the metal micro-needle has the advantages that the metal micro-needle array female die tolerant to high temperature and high pressure can be produced in batch at low cost, the shape and height of micro-needles are controllable, and industrial batch production is benefited.

Description

Technical field [0001] The invention relates to a method for preparing a workpiece, in particular to a method for preparing a mold, which is used for a metal microneedle array female mold Background technique [0002] Microneedling is a new type of physical penetration enhancement method that has been considered to have great application prospects in recent years. It is a high-tech physical penetration enhancement technology that has been born with the rapid development of microprocessing technology. The size of the microneedles and the distance between the microneedles are in the micron level, which can easily pass through the stratum corneum without touching the subcutaneous nerve, so it will not cause pain. The microneedle is mainly used to cure the drug in the microneedle and then insert it into the skin to achieve administration, or directly dissolve in the skin. Microneedle technology can also be used in conjunction with other penetration enhancement methods such as iontop...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): A61M37/00
CPCA61M37/0015A61M2037/0053
Inventor 李丁崔大祥邓敏郭仁凤
Owner 上海揽微医学科技有限公司
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