Polyphenylene sulfide resin composition with low dielectric constant and preparation method thereof
A polyphenylene sulfide resin, low dielectric constant technology, applied in the field of engineering plastics, can solve the problems of low metal drawing force, low drawing force, low dielectric constant of polyphenylene sulfide resin composition, etc. Excellent flammability
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Embodiment 1
[0062] Embodiment 1: The polyphenylene sulfide resin composition of this embodiment includes the following components in parts by mass:
[0063]
[0064]
[0065] The preparation method of the polyphenylene sulfide resin composition in the present embodiment is as follows:
[0066] According to the proportion, the above PPS resin, cage silsesquioxane, toughening agent, antioxidant, heat stabilizer and lubricant are mixed to obtain a mixture;
[0067] Add glass fiber to the mixture, put it into an extruder, carry out melt extrusion and granulation, stir evenly, and obtain a polyphenylene sulfide resin composition.
[0068] The heating temperature of the extruder is set as follows: Zone 1 160~200℃, Zone 2 220~250℃, Zone 3 230~270℃, Zone 4 250~290℃, Zone 5 270~310℃, Zone 6 280~320℃ And machine head 260 ~ 280 ℃.
Embodiment 2
[0069] Embodiment 2: The polyphenylene sulfide resin composition of this embodiment includes the following components in parts by mass:
[0070]
[0071] The preparation method of the polyphenylene sulfide resin composition of this example is the same as that of Example 1.
Embodiment 3
[0072] Embodiment 3: The polyphenylene sulfide resin composition of this embodiment includes the following components in parts by mass:
[0073]
[0074] Among them, the glass fiber is chopped glass fiber with low dielectric constant, the toughening agent is glycidyl methacrylate copolymer and styrene / butadiene / styrene block copolymer, and the heat stabilizer is metal oxide and ultraviolet ray A mixture of light absorbers.
[0075] The preparation method of the nano-injection-molded polyphenylene sulfide resin composition in this example is the same as that in Example 2.
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