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Substrate processing device

A technology for processing devices and substrates, applied in the direction of workbenches, manufacturing tools, electrical components, etc., can solve the problems of increased installation area, increased costs, and longer production lines, and achieve the effect of suppressing the installation area

Inactive Publication Date: 2018-07-13
MITSUBOSHI DIAMOND IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When each part and each device are arranged in this way, the line for processing the substrate becomes longer, so the installation area of ​​the whole device increases, and the cost of the whole device also increases

Method used

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Examples

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Embodiment Construction

[0051] Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, in each drawing, the XYZ axis|shaft orthogonal to each other is shown for convenience. The X-Y plane is parallel to the horizontal plane, and the positive direction of the Z-axis is the vertical direction.

[0052] figure 1 It is a perspective view showing the structure of the substrate processing apparatus 1 .

[0053] The substrate processing apparatus 1 includes a supply unit 100 , a conveyance unit 200 , a scribing unit 300 , and a breaking unit 400 . The supply unit 100 receives the substrate 10 supplied from an upstream device of the substrate processing device 1 . The transfer unit 200 receives the substrate 10 from the supply unit 100 , and delivers the received substrate 10 to the scribing unit 300 and the breaking unit 400 . The scribing unit 300 forms scribe lines on the surface of the substrate 10 . The breaking unit 400 cuts the delivered su...

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Abstract

The present invention provides a substrate processing apparatus capable of suppressing the installation area of the apparatus and the cost of the apparatus. A substrate processing apparatus (1) includes a scribing unit (300) for forming a scribe line on a surface of a substrate (10); a feeding table (110) for carrying the substrate 10 and attracting the carried substrate (10); a carrying unit (120) for carrying the feeding table (110) between a first position for carrying the substrate (10) on the feeding table (110) and a second position for delivering the substrate (10) to the scribing unit(300); a rotating part (130) for rotating the feeding table (110) up and down; and a control part. The control part delivers the substrate (10) on which the scribe line is formed by the scribing unit(300) at the second position to the feeding table (110) and attracts the substrate (10) to the feeding table (110), and then drives the rotating part (130) to rotate the feeding table (110) up and down and invert the front and back of the substrate (10).

Description

technical field [0001] The present invention is a substrate processing device for processing a substrate. Background technique [0002] There is known a device that rotates a cutter wheel on the surface of a substrate placed on a table to form a plurality of scribed lines, and uses an inversion unit to invert the front and back of the substrate on which the scribed lines have been formed. The surface opposite to the scribed line presses the breaking lever to bend the substrate to cut the substrate, and the cut substrate is taken out (for example, Patent Document 1). [0003] prior art literature [0004] Patent Document 1: Japanese Patent Application Laid-Open No. 6-227835 [0005] In the above-mentioned device, the supply unit that supplies the substrate, the scribing device that forms the scribe line on the substrate, the breaking device that cuts the substrate, and the reversing unit arranged between the scribing device and the breaking device are viewed from above. co...

Claims

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Application Information

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IPC IPC(8): B25H7/04B25H1/10
CPCB25H1/10B25H7/04H01L21/67092H01L21/67742H01L21/683H01L21/68764
Inventor 高松生芳
Owner MITSUBOSHI DIAMOND IND CO LTD
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