Substrate processing apparatus

Abstract

Provided is a substrate processing apparatus which saves space and reduces cost. The substrate processing apparatus is provided with a plurality of substrate processing chambers (230, 240, 250), and a common transfer chamber (220) for transferring a substrate (W) to each substrate processing chamber. In the substrate processing apparatus, prescribed process is performed to the substrate (W) while transferring the substrate (W) in the upright posture. At least one of the substrate processing chambers (230, 240, 250) is arranged above or below the common transfer chamber (220), and a substrate passing port through which the substrate (W) can pass through is arranged at a boundary section between the processing chamber and the transfer chamber (220).

Description

technical field [0001] The present invention relates to a substrate processing apparatus for performing predetermined processing on substrates such as glass substrates. Background technique [0002] In the manufacturing process of semiconductors, liquid crystals, thin-film solar cells, etc., substrate processing equipment for performing CVD (Chemical Vapor Deposition: chemical vapor phase growth), sputtering, dry etching, etc. Substrate transport mechanism for each processing chamber in the device. In such a substrate conveyor, the substrate is generally conveyed in a horizontally laid state. However, with the recent increase in the size of flat-panel displays and the increase in the area of ​​solar cells, glass substrates, which are their main components, have been accelerated. The increase in size causes problems such as damage to the substrate caused by bending due to its own weight and an increase in the installation area of ​​the substrate processing apparatus. [000...

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Problems solved by technology

[0006] However, the substrate processing apparatus described in Patent Document 1 is configured such that after the substrate is raised to the same height as the upper processing section by an elevator, the substrate is carried in from the front of the processing section, and thereafter, another elevator is used to lift the substrate from the processing section. The substrates unloaded from the rear of the processing section are lowered to the common transfer chamber after processing, so it is necessary to provide a space for the elevator to stay before and after each processing section

Therefore, it is necessary to arrange the processing chambers at a large distance from each other, and the dedicated area of ​​the entire device cannot be sufficiently reduced.

In addition, since it is necessary to install two elevators for board loading and unloading for each processing section, there is a problem of increased equipment cost.

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