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One-component addition type organic silicon electric-conduction adhesive and preparation method thereof

A silicone, addition type technology, used in conductive adhesives, adhesives, adhesive additives, etc., can solve the problems of wasteful equipment cleaning, toxicity, affecting the surface flatness of products, etc., and achieve excellent conductivity and high stability. Effect

Inactive Publication Date: 2018-07-03
苏州瑞力博新材科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the two-component process will bring inconvenience to the construction: accurate measurement by the operator is required; mixing equipment and defoaming equipment are required (especially for high-viscosity systems, which are more challenging); if the mixed materials cannot be used in time, they will solidify and cause Waste and equipment cleaning is not easy
[0005] The disadvantages of the one-component addition type silicone conductive adhesive in the prior art are: a large amount of stabilizer (such as acetylenic alcohol) needs to be added; the stabilizer will volatilize during the curing process, which will increase the volume shrinkage of the product and affect the smoothness of the product surface Generally speaking, acetylenic alcohol compounds have certain toxicity, which limits their application in some fields; low temperature storage is required, the demand for energy is large, and it is inconvenient for transportation and storage; the stable storage time is short

Method used

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  • One-component addition type organic silicon electric-conduction adhesive and preparation method thereof
  • One-component addition type organic silicon electric-conduction adhesive and preparation method thereof
  • One-component addition type organic silicon electric-conduction adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] Mix 20.50 g of the one-component addition type silicone synthesized in Synthesis Example 1 (containing catalyst Pt 5 ppm), 0.58 g of methylhydrogensiloxane-dimethylsiloxane copolymer and 78.92 g of silver powder to obtain a single Component addition type silicone conductive adhesive.

Embodiment 2

[0041] 31.50 g of one-component addition type silicone synthesized in Synthesis Example 2, 5.68 g of phenyl-tris(dimethylsiloxy)silane, 1.26 mg of platinum-methylvinylcyclosiloxane complex and silver 62.82 g of copper clad was mixed evenly to obtain a one-component addition type silicone conductive adhesive.

Embodiment 3

[0043] The one-component addition type silicone 31.50, phenyl-tris(dimethylsiloxy)silane 15.56g, platinum-methylvinylcyclosiloxane complex 3.46mg and silver-coated Mix 52.94 g of aluminum evenly to obtain a one-component addition type silicone conductive adhesive.

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PUM

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Abstract

The invention discloses a one-component addition type organic silicon electric-conduction adhesive and a preparation method thereof. According to the present invention, the trimeric cyanurate group capable of stabilizing the catalyst is introduced into the matrix material of the electric-conduction adhesive through molecular design so as to obtain the one-component addition type organic silicon electric-conduction adhesive capable of being stably stored at the room temperature; and the one-component addition type organic silicon electric-conduction adhesive capable of being stably stored is provided, and has advantages of no requirement of adding of a large amount of stabilizers such as alkynol, good storage stability at room temperature, fast curing, good electrical conductivity and the like.

Description

technical field [0001] The present invention relates to a one-component addition type silicone conductive adhesive and its preparation method, more precisely, the present invention relates to a one-component addition type conductive adhesive based on silicone resin which can be stored stably at room temperature . Background technique [0002] In the electronics industry, conductive adhesive is an adhesive with certain conductive properties after curing or drying. It usually uses matrix resin and conductive particles as the main components, and the conductive particles are combined through the bonding effect of the matrix resin. Form a conductive path and realize the conductive connection of the adhered material. Since the matrix resin of the conductive glue is an adhesive, an appropriate curing temperature can be selected for bonding, which avoids material deformation and electronic device damage that may be caused by high temperature welding. Thermal damage and the formati...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/08C09J9/02C09J11/06C09J11/08
CPCC08K3/08C08K5/5419C08K9/10C08K2003/0806C08K2003/0812C08K2003/085C09J11/06C09J11/08C09J183/08C08L83/04
Inventor 李志明宋艳朱江
Owner 苏州瑞力博新材科技有限公司
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