Production method of PCB (printed circuit board) and PCB

Abstract

The invention provides a production method of a PCB (printed circuit board). The method comprises the steps as follows: S10, providing an inner core veneer, performing primary electroplating on the inner core veneer, and producing an inner circuit graph; S20, selecting a matched prepreg according to the adhesive flow, and laminating the inner core veneer, the prepreg, an upper sub-PCB and a lowersub-PCB to form the PCB; S30, performing drilling and secondary electroplating on the PCB to produce an outer circuit graph and at least two copper drawing holes which penetrate through the PCB and avoid the inner circuit graph; S40, baking the PCB to the preset temperature, then, spraying tin, and covering a graph zone of the outer circuit graph with an anti-corrosion tin layer. On the other hand, the invention provides the PCB applied to an alternating current charging pile. The production method of the PCB and the PCB can solve the reliability problems of copper surface warping, layering, blistering and the like, and the assembly stability of the alternating current charge pile is guaranteed.

Description

technical field [0001] The invention relates to the technical field of PCBs, in particular to a PCB manufacturing method and the PCB. Background technique [0002] With the vigorous development of the charging pile industry, it also drives the development of domestic charging pile PCBs. Compared with ordinary PCBs, PCBs used for charging piles carry larger currents and higher voltages, and PCBs used for charging piles need to withstand high voltages, and the thickness of the insulating layer should also be larger. Therefore, the conductive line of the PCB used for charging piles should be wider, and most of them are thick copper plates, which are much thicker than ordinary PCBs. If they are thin plates, they are easy to heat up and burn out, and thick copper plates can carry many and heavy electronic components after packaging. Devices, to avoid PCB deformation damage. [0003] However, due to the thick copper and board thickness of the PCB for charging piles, when the tem...

AI Technical Summary

Problems solved by technology

[0003] However, due to the thick copper and board thickness of the PCB for charging piles, when the temperature increases sharply, the PCB for charging piles is prone to a series of reliability problems such as layered blistering and copper surface warping, resulting in uneven surfaces. , affecting the performance and assembly of the line graphics layer

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