Heat dissipation device of computer server

Abstract

The invention discloses a heat dissipation device of a computer server, and belongs to the technical field of computer servers. The heat dissipation device is used for solving the problems that existing large-sized computer servers are mostly subjected to heat dissipation through fans, so that the heat dissipation effect is influenced by temperature and is monotonous and not ideal. The heat dissipation device comprises a box body, the top of the box body is provided with an exhaust fan, the lower portion of the exhaust fan is provided with support plates for placing the server, and a cooling water pipe is arranged in the portion, at the lower portions of the support plates, of the box body; a heat dissipation assembly is arranged on the support plates and comprises a heat sink, heat conduction plates, a heat conduction pipe, a water pump and a water tank, the heat sink is arranged on the support plates, one end of each heat conduction plate is connected with the heat sink, and the other end of each heat conduction plate penetrates through the side wall of the box body and is connected with the heat conduction pipe; the cooling water pipe is arranged in an S-shaped shape, one end ofthe cooling water pipe penetrates through the heat conduction pipe and is connected with the water pump, the other end of the water pump is connected with a water tank, and the other end of the cooling water pipe is connected with the bottom of the water tank.

Description

technical field [0001] The invention relates to the technical field of computer servers, in particular to a cooling device for computer servers. Background technique [0002] With the development of information technology, cloud computing and big data are gradually entering people's lives. With the improvement of computer computing and processing capabilities, the heat generated by chips is also increasing at an alarming rate. The server chassis is similar to the general computer chassis, including processor, hard disk, memory, system bus, etc. Due to the continuous development of electronic technology at this stage, with the continuous improvement of system and device power consumption, the heat generated by the internal components of the server continues to increase. , heat dissipation has become the biggest problem facing server development. Most of the heat dissipation of existing large-scale computer servers is through fans, which leads to the effect of heat dissipatio...

AI Technical Summary

Problems solved by technology

[0003] In order to solve the problem that most of the heat dissipation of the existing large-scale computer servers is through the fan, thereby causing the heat dissipation effect to be affected by the temperature, the heat dissipation effect is single, and the heat dissipation effect is not ideal. The present invention provides a computer server heat dissipation device

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