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Cooling plate

A cooling plate and bottom plate technology, which is applied in the direction of fixed plate conduit assembly, ion implantation plating, gaseous chemical plating, etc., can solve the problem of uneven temperature of the cooling plate

Pending Publication Date: 2018-06-05
紫石能源有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention provides a cold water plate to solve the technical problem of uneven temperature of the cooling plate itself

Method used

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Embodiment Construction

[0028] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0029] In the description of the present invention, it should be noted that unless otherwise specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. Connected, or integrally connected; it can be mechanically conn...

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PUM

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Abstract

The invention relates to the technical field of cooling equipment in the field of vacuum plating, and discloses a cooling plate which comprise a cooling plate body, wherein a circulating water channelis arranged in the cooling plate body, and the circulating water channel is a water channel with a water inlet channel and a water return channel parallel to each other. For the cooling plate provided by the invention, by arranging the circulating water channel with the water inlet channel and the water return channel parallel to each other in the cooling plate body, the heat exchange efficiencyof the cooling plate is increased, and the problem of non-uniform overall temperature of the cooling plate caused by water inlet and water return temperature difference is solved.

Description

technical field [0001] The invention relates to the technical field of cooling equipment in the field of vacuum coating, in particular to a cooling plate. Background technique [0002] The cooling plate for vacuum coating is generally installed in the process chamber and the film output side of the coating equipment. It can continuously take away heat through its own circulating cooling liquid, thereby speeding up the cooling speed of the substrate, effectively reducing the temperature of the substrate when it is exposed to the atmosphere, and shortening the overall process of the equipment. the beat. [0003] Most of the existing cooling plate structures in the field of vacuum coating adopt a structure in which the middle and deep holes of the thick plate are drilled to form a single-circuit water channel and the water pipe is directly bent and formed. This kind of water channel structure for deep hole drilling of thick plates is limited by the processing technology. Most ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/22C23C16/46
CPCH01J37/32724F28F2210/10C23C14/541F28F3/12F28D1/0366F28D1/0472F28D2021/0077F28F27/00H01L21/67109H01L21/6715C23C16/463C23C16/4586H01L21/67103H01L21/67017H01L21/67248F28D9/0081
Inventor 邓曾红管长乐
Owner 紫石能源有限公司
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