Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Chip on film unit

A chip-on-film and driving circuit technology, which is applied in the field of liquid crystal display, can solve the problems of difficulty in heat dissipation and cooling of chip-on-film units, and achieve the effects of reducing the risk of pin breakage, ensuring temperature uniformity, and ensuring quality.

Active Publication Date: 2015-04-01
TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
View PDF5 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Aiming at the defect that the chip-on-chip film unit in the prior art is difficult to dissipate heat and cool down, the present invention proposes an improved chip-on-chip film unit, which effectively solves the above problems and brings new beneficial effects at the same time

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Chip on film unit
  • Chip on film unit
  • Chip on film unit

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0023] The present invention will be further described below in conjunction with accompanying drawing.

[0024] figure 2 The chip-on-film unit 10 according to the present invention in the first embodiment is shown. pass figure 2 It can be clearly seen that the COF unit 10 first includes a soft dielectric layer 11 . The soft dielectric layer 11 is a flexible carrier made of, for example, polyimide.

[0025] A plurality of pins (not shown in the figure) for inputting signals are arranged on the soft dielectric layer 11 , and the soft dielectric layer 11 can be used as a carrier film for these pins to facilitate tape-and-roll transmission.

[0026] Two drive circuit modules are also arranged on the soft dielectric layer 11, namely a first drive circuit module 12.1 and a second drive circuit module 12.2. There is a certain distance between the first driving circuit module 12.1 and the second driving circuit module 12.2, which can be determined according to the process and th...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a chip on film unit, and belongs to the technical field of liquid crystals. The chip on film unit comprises a soft dielectric layer, a plurality of lead pins, a first driving circuit module and a second driving circuit module, wherein the lead pins are positioned on the soft dielectric layer and are used for inputting signals, the first driving circuit module is connected with at least one part of the lead pins used for inputting the signals, in addition, a cascade lines are arranged between the first driving circuit module and the second driving circuit module for establishing cascade signals therebetween. The number of signal channels of each driving circuit module can be a half of the required number of the signal channels of the whole chip on film unit, so that the signal channels can be dispersed on a plurality of driving circuit modules, and the heat radiation efficiency is greatly improved.

Description

technical field [0001] The invention relates to the technical field of liquid crystal display, in particular to a chip-on-chip film unit. Background technique [0002] Chip-on-film (COF, English full name is Chip On Flex or Chip On Film) is widely used in the field of liquid crystal display technology. It mainly refers to the chip soft film construction technology that fixes the integrated circuit on the flexible circuit board, and uses the soft additional circuit board as the chip carrier to package the chip, so as to bond the chip with the flexible substrate circuit. [0003] figure 1 A chip-on-film unit in the prior art is shown. In the prior art, usually one driving circuit module is arranged in one chip-on-film unit. However, this situation is not conducive to heat dissipation and cooling. Such as figure 1 As shown, the chip-on-film unit in the prior art includes a soft dielectric layer 1 and a driving circuit module 2 located on the soft dielectric layer 1 . For ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G02F1/133
CPCG02F1/13306H01L23/5387G02F1/13452G02F1/133G02F1/133305G02F1/133345G02F1/136H01L23/49838H01L23/4985
Inventor 扶伟陈宥烨陈胤宏
Owner TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com