A kind of transparent invisible RFID tag material and preparation method
An RFID tag, invisible technology, applied in the field of RFID, can solve the problems of easy damage, loss of product authenticity and uniqueness, weak bending resistance of RFID tags, etc., to reduce surface resistance, good anti-theft and anti-counterfeiting functions, and wide application atmosphere Effect
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Embodiment 1
[0023] A kind of preparation of transparent invisible RFID tag material:
[0024] S1, take a PET film with a thickness of 0.01mm as the matrix film, lay it flat on the coating platform, and coat 0.1% nano-silver wire conductive silver paste on the matrix layer through a coating machine, the length and diameter of the nano-silver wire The ratio is 1000, the coating thickness is 30 μm, and the nano-silver wire conductive silver paste is cured at room temperature to obtain a conductive layer;
[0025] S2, preparation of conductive layer pattern: the conductive layer prepared in step S1 forms a conductive pattern by screen printing;
[0026] S3, preparation of the adhesive layer: the surface of the conductive layer prepared in step S2 is further coated with a UV-curable pressure-sensitive adhesive on the conductive layer, the coating thickness is 5 μm, and the thickness is 2 J / cm under the irradiation of a UV lamp. 2 The energy curing, that is, transparent invisible RFID label ma...
Embodiment 2
[0028] Preparation of a transparent invisible RFID label material:
[0029] S1, take a PE film with a thickness of 0.2mm as the matrix film, lay it flat on the coating platform, and coat 0.2% nano-silver wire and nano-silver particle conductive silver paste on the matrix layer through a coating machine, the nano-silver wire The ratio of length to diameter is 700, the coating thickness is 40 μm, and the conductive silver paste of nano-silver wire is cured at room temperature to obtain a conductive layer;
[0030] S2, preparation of conductive layer pattern: the conductive layer prepared in step S1 is mechanically embossed to form a conductive pattern;
[0031] S3, preparation of the adhesive layer: the surface of the conductive layer prepared in step S2 is further coated with a hot-melt adhesive on the conductive layer to a thickness of 8 μm, and cured at room temperature for 3 hours to obtain a transparent invisible RFID label material.
Embodiment 3
[0033] A kind of preparation of transparent invisible RFID tag material:
[0034] S1, take a PVC film with a thickness of 0.3mm as the matrix film, lay it flat on the coating platform, and coat 0.3% nano-silver wire conductive silver paste on the matrix layer through a coating machine, the length and diameter of the nano-silver wire The ratio is 500, the coating thickness is 50 μm, and the nano-silver wire conductive silver paste is cured at room temperature to obtain a conductive layer;
[0035] S2, preparation of conductive layer pattern: the conductive layer prepared in step S1 is mechanically embossed to form a conductive pattern;
[0036] S3, preparation of the adhesive layer: the surface of the conductive layer prepared in step S2 is further coated with a solvent-based resin adhesive on the conductive layer to a thickness of 10 μm, and cured at room temperature for 3 hours to obtain a transparent invisible RFID label material.
[0037] The production of conductive lines...
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