Low-dielectric-loss and high-strength electronic material

Abstract

The invention belongs to the technical field of electronic materials and relates to a low-dielectric-loss and high-strength electronic material. The low-dielectric-loss and high-strength electronic material is prepared from, by weight, 5-12 parts of heat-resistant glass, 25-30 parts of andalusite ceramic, 5-15 parts of phenol-formaldehyde resin, 45-65 parts of linear phenolic resin, 15-35 parts ofdimethyl hydantoin formaldehyde resin, 20-35 parts of benzocyclobutene resin, 10-15 parts of tributylamine, 10-25 parts of acrolein, 2-7 parts of graphite powder, 4-7 parts of titanium dioxide, 2-7 parts of cyclopropylmagnesium bromide, 3-8 parts of aluminum distearate, 15-25 parts of 4-nitro phthalimide, 15-22 parts of ethyl urethane, 15-20 parts of polystyrene, 1-3 parts of mica and 11-14 partsof natural rubber. The electronic material has high heat conductivity and low dielectric constant and dielectric loss, is capable of stopping currents from passing, high in compression strength and heat resistance and capable of resisting heat for a long time without significant changes.

Description

technical field [0001] The invention relates to an electronic material with low dielectric loss and high strength, belonging to the technical field of electronic materials. Background technique [0002] The dielectric loss in the transmission process of existing electronic materials is relatively high, and the heat conduction needs to be further strengthened. Moreover, the compressive strength is not good, the customer feedback after use is not good, and the market share is low. Contents of the invention [0003] Aiming at the problems in the prior art, the object of the present invention is an electronic material with low dielectric loss and high strength. [0004] In order to achieve the above object, the technical solution adopted by the present invention is: a kind of electronic material with low dielectric loss and high strength, the composition by weight parts includes: heat-resistant glass: 5-12 parts, andalusite porcelain: 25 parts -30 parts, phenol formaldehyde ...

AI Technical Summary

Problems solved by technology

[0002] The dielectric loss in the transmission process of existing electronic materials is relatively high, and the heat conduction needs to be further strengthened

Moreover, the compressive strength is not good, the customer feedback after use is not good, and the market share is low