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Cooling reflection plate

A reflector and heat dissipation technology, applied in the field of heat dissipation reflectors, can solve problems such as poor heat dissipation, large volume, and affecting product performance, and achieve the effects of controlling the total thickness, significant conduction, and thinning the thickness

Pending Publication Date: 2018-05-01
苏州佳值电子工业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the upgrading of electronic products, consumers require electronic products to be as thin as possible, as light as possible, as well as beautiful in lighting. However, the above requirements pose a great threat to the heat dissipation effect of electronic products and affect the performance of the product itself.
The drawbacks of existing heat dissipation reflectors for electronic products are mainly: either the heat dissipation effect can be achieved, but the reflection effect is not ideal, or the reflection effect is achieved, the heat dissipation effect is poor, and the volume is large.

Method used

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  • Cooling reflection plate

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Embodiment Construction

[0017] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0018] Such as figure 1 As shown, the heat dissipation reflective sheet of the present invention includes a colloid layer 1 , an aluminum powder layer 2 , a copper foil layer 3 , and an ink layer 4 which are laminated.

[0019] In order to make the heat dissipation reflective sheet of the present invention have significant conduction, heat dissipation, and reflection effects, and have a thinner thickness, each structural layer is arranged in the following mann...

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Abstract

The invention provides a cooling reflection plate. The cooling reflection plate comprises a colloid layer, an aluminum powder layer, a copper foil layer and an ink layer which are arranged in lamination way, wherein the colloid layer is arranged on a surface of the aluminum powder layer by a printing mode, one surface of the copper foil layer is arranged on the other surface of the aluminum powderlayer, one surface of the ink layer is arranged on the other surface of the copper foil layer by the printing mode, and the ink layer comprises the following constituents based on parts by weight: 20-40% of polyurethane acrylic resin, 3-5% of carbon black, 30-40% of solvent and 30-40% of talcum powder. The cooling reflection plate has remarkable effects of conduction, cooling and reflection, a mode of laminating multiple layers of materials is employed, the total thickness is effectively controlled, the occupied space is saved, and the thickness of an electronic product is favorably reduced.

Description

technical field [0001] The invention relates to a heat dissipation reflection sheet, in particular to a heat dissipation reflection sheet with good conduction, heat dissipation and reflection effects. Background technique [0002] With the upgrading of electronic products, consumers require electronic products to be as thin as possible, as light as possible, and to have beautiful lighting. However, the above requirements pose a great threat to the heat dissipation effect of electronic products and affect the performance of the product itself. The disadvantages of existing heat dissipation reflectors for electronic products are mainly: either they can achieve heat dissipation effect, but the reflection effect is not ideal, or they only achieve reflection effect, poor heat dissipation effect, and large volume. Therefore, in view of the above problems, it is necessary to propose a further solution. Contents of the invention [0003] The invention aims to provide a heat dissi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20G02B5/08
CPCH05K7/2039G02B5/0808
Inventor 李云涛
Owner 苏州佳值电子工业有限公司
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