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Liquid type semiconductor heat exchanger

A technology of heat exchangers and semiconductors, applied in the field of heat exchange, can solve problems such as poor cooling effect, and achieve the effect of avoiding the need for external solenoid valves, reducing the use, and reducing the use of refrigerants

Inactive Publication Date: 2018-05-01
CHENGDU AERONAUTIC POLYTECHNIC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The object of the present invention is to provide a liquid semiconductor heat exchanger to solve the problem of poor cooling effect of the existing semiconductor refrigeration sheet in application, especially in the aspect of air conditioning refrigeration

Method used

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  • Liquid type semiconductor heat exchanger
  • Liquid type semiconductor heat exchanger
  • Liquid type semiconductor heat exchanger

Examples

Experimental program
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Embodiment

[0027] Please refer to figure 1 , figure 2 and image 3 , The liquid semiconductor heat exchanger 100 of the embodiment of the present invention includes: a casing 110 , a heat exchanging device 120 disposed in the casing 110 , and a driving device 130 electrically connected to the heat exchanging device 120 .

[0028] Please refer to Figure 4 and Figure 5 , the heat exchange device 120 includes a semiconductor thermoelectric chip 121 , a plate type liquid double-sided heat exchanger 122 and a plate type liquid single-side heat exchanger 123 . The plate-type liquid double-sided heat exchanger 122 is located in the middle of the heat exchange device 120, and the two sides of the plate-type liquid double-side heat exchanger 122 are provided with semiconductor thermoelectric sheets 121 and plate-type liquid single-side heat exchangers 123 sequentially from inside to outside. The semiconductor thermoelectric sheet 121 is arranged between the plate type liquid double-sided h...

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Abstract

The invention discloses a liquid type semiconductor heat exchanger and belongs to the technical field of heat exchange. The liquid type semiconductor heat exchanger comprises a housing, a heat exchange device arranged in the housing and driving devices electrically connected with the heat exchange device, wherein the heat exchange device comprises semiconductor thermoelectric sheets, a plate typeliquid double-side heat exchanger and plate type liquid single-side heat exchangers; the plate type liquid double-side heat exchanger is located in the middle of the heat exchange device; the semiconductor thermoelectric sheets and the plate type liquid single-side heat exchangers are successively arranged on two sides of the plate type liquid double-side heat exchanger from inside to outside. Through the liquid type semiconductor heat exchanger, the heat absorption area is reduced; the heat releasing area is increased; the heating efficiency of the semiconductor thermoelectric sheets is greater than 1 and is fully used; the liquid type semiconductor heat exchanger can be used as a core of an air energy water heater and can also be used as a core of a heating and cooling air conditioner.

Description

technical field [0001] The invention relates to the technical field of heat exchange, in particular to a liquid semiconductor heat exchanger. Background technique [0002] In 1821, German Seebeck (see-beck) discovered the thermoelectric effect in metals, which was only applied to the thermocouple for measuring temperature. After the emergence of semiconductors, it was found that it can obtain a much larger thermoelectromotive force than metals, and has a higher efficiency in the conversion of thermal energy and electrical energy. Therefore, it has been developed in thermoelectric power generation and thermorefrigeration. [0003] A semiconductor cooler, also called a thermoelectric cooler, is a heat pump. Its advantage is that there are no sliding parts, and it is used in some occasions where the space is limited, the reliability is high, and there is no refrigerant pollution. Utilizing the Peltier effect of semiconductor materials, when direct current passes through a gal...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F25B21/04F25B49/00
CPCF25B21/04F25B49/00F25B2321/0212F25B2321/023F25B2500/12
Inventor 门正兴王子强郑金辉唐鑫马亚鑫唐越
Owner CHENGDU AERONAUTIC POLYTECHNIC
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