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A kind of tin plating leveling method for circuit board

A circuit board and tin plating technology, applied in printed circuits, printed circuit manufacturing, electrolytic components, etc., can solve the problems of uneven thickness of the coating, uneven tin content, too thin, etc., to improve the quality of electroplating, maintain uniform concentration, The effect of enhancing liquidity

Active Publication Date: 2019-05-10
重庆市志益鑫电子科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the prior art, the circuit board to be tinned is placed in the plating tank, and then the circuit board is energized to electroplate the circuit board. During the electroplating process, the plating solution in the plating tank is in a static state, resulting in During the electroplating process, the tin content in the part of the plating solution is uneven, which will greatly reduce the plating speed of the circuit board; but the way of spraying the plating solution from the nozzle will cause the plating solution to not flow smoothly, resulting in If the local tin plating thickness is too thick or too thin, it will also lead to uneven thickness of the plating layer. Both of the above situations will lead to unqualified quality of the circuit board.

Method used

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  • A kind of tin plating leveling method for circuit board
  • A kind of tin plating leveling method for circuit board

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Embodiment Construction

[0020] Further detailed explanation through specific implementation mode below:

[0021] The reference signs in the drawings of the description include: electroplating tank 10, first chute 101, second chute 102, sealing strip 103, cover plate 20, water pump 30, feeding tank 31, first communicating pipe 301, second communicating pipe Pipe 302, first pole 303, first accommodation chamber 313, second pole 304, second accommodation chamber 314, spray block 305, third accommodation chamber 315, vertical through groove 325, through hole 335, fan blade 401 , the first one-way valve 402 , the second one-way valve 403 , the conductive rod 50 , and the circuit board 60 .

[0022] The tinning equipment in the embodiment is basically as attached figure 1 And attached figure 2 Shown: including electroplating box 10, cover plate 20, spraying mechanism and vertically arranged conductive rod 50, cover plate 20 is detachably connected to the upper end of electroplating box 10, and is provid...

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PUM

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Abstract

The invention relates to the field of circuit board machining methods, and particularly discloses a tin plating leveling method for a circuit board. According to the tin plating leveling method for the circuit board, a tin plating device is adopted, a spraying mechanism in the tin plating device can be used for enhancing the liquidity of an electroplating solution in an electroplating box in the tin plating process, and the electroplating solution on the two sides of the circuit board can be exchanged, so that the electroplating solution in the whole electroplating box is uniform and stable and the electroplating efficiency of the circuit board can be effectively improved.

Description

technical field [0001] The invention belongs to the field of circuit board processing methods, and in particular relates to a tinning and leveling method for circuit boards. Background technique [0002] A circuit board (PCB) electrically connects each device mounted thereon through a wiring pattern formed on an insulating material, then supplies power and the like to each device, and at the same time, mechanically fixes the devices. In the process of manufacturing a double-sided PCB, it is necessary to form a protective layer made of gold, nickel, tin, etc. on the outermost layer of the circuit pattern on both sides of the PCB. [0003] In the prior art, the circuit board to be tinned is placed in the plating tank, and then the circuit board is energized to electroplate the circuit board. During the electroplating process, the plating solution in the plating tank is in a static state, resulting in During the electroplating process, the tin content in the part of the platin...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D21/10C25D17/00C25D3/30H05K3/18
CPCC25D3/30C25D17/00C25D21/10H05K3/188
Inventor 胡红生
Owner 重庆市志益鑫电子科技有限公司
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