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Minisized piezoelectric ultrasonic energy transducer and manufacturing method therefor

A piezoelectric ultrasonic and manufacturing method technology, which is applied in the directions of loudspeakers, sensors, electrical components, etc., can solve the problems of low electromechanical coupling coefficient of transducers, improve the electromechanical coupling coefficient, improve energy conversion efficiency, and reduce working energy. consumption effect

Inactive Publication Date: 2018-04-17
深圳市诺维创科技有限公司
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  • Summary
  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0004] In view of this, the embodiment of the present invention provides a miniature piezoelectric ultrasonic transducer and its manufacturing method to solve the problem of low electromechanical coupling coefficient of existing transducers

Method used

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  • Minisized piezoelectric ultrasonic energy transducer and manufacturing method therefor
  • Minisized piezoelectric ultrasonic energy transducer and manufacturing method therefor
  • Minisized piezoelectric ultrasonic energy transducer and manufacturing method therefor

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Embodiment Construction

[0038] The specific implementation of the micro piezoelectric ultrasonic transducer provided by the embodiment of the present invention and its manufacturing method will be described in detail below with reference to the accompanying drawings.

[0039] The thickness and area shape of each layer in the drawings do not reflect the real scale of the miniature piezoelectric ultrasonic transducer, and the purpose is only to illustrate the content of the present invention.

[0040] A kind of miniature piezoelectric ultrasonic transducer provided by the invention, such as figure 2 As shown, it includes: a silicon substrate 100, at least one diaphragm structure 200 disposed on the silicon substrate 100, the diaphragm structure 200 consists of a hollow structure A protruding from the silicon substrate 100 and a hollow structure A protruding from the outside of the hollow structure A At least one trailing structure B of the surface constitutes.

[0041] The above-mentioned miniature p...

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Abstract

The invention discloses a minisized piezoelectric ultrasonic energy transducer and a manufacturing method therefor. At least one vibrating membrane structure is arranged on a silicon substrate; the vibrating membrane structure consists of a hollow structure arranged on the silicon substrate in a protruding manner and at least one trailing structure arranged on an outer surface of the hollow structure in a protruding manner. The vibrating membrane structure is changed from a two dimensional plane structure into a three dimensional stereoscopic hollow structure, no supporting layer is needed inthe energy transducer, and ultrasonic energy transduction can be realized via the vibrating membrane structure. Because the vibrating membrane structure has a three dimensional stereoscopic curved surface, a strain direction generated via the vibrating membrane structure is changed from a transverse direction into a direction of dip that forms a certain angle with the transverse direction when theenergy transducer is in operation, strain generated via the vibrating membrane structure can be used for directly bringing about shape change and vibration in a direction vertical to the silicon substrate, a conversion process of converting transverse train into vertical strain is not needed, an electromechanical coupling coefficient of the minisized piezoelectric ultrasonic energy transducer canbe improved, energy conversion efficiency of the energy transducer can be improved, and work energy consumption can be lowered.

Description

technical field [0001] The invention relates to the technical field of transducers, in particular to a miniature piezoelectric ultrasonic transducer and a manufacturing method thereof. Background technique [0002] At present, the common miniature piezoelectric ultrasonic transducer adopts a two-dimensional planar diaphragm structure, that is, figure 1 As shown, the transducer includes: a support layer 2 disposed on a silicon substrate 1, and a first electrode layer 3, a piezoelectric layer 4, and a second electrode layer 5 sequentially disposed on the support layer 2; wherein, the first The electrode layer 3, the piezoelectric layer 4 and the second electrode layer 5 constitute a two-dimensional planar diaphragm structure, and the transducer converts the input electrical signal into ultrasonic energy for output through the vibration of the diaphragm structure. When the transducer works, it relies on the piezoelectric layer 4 to generate lateral strain. With the assistance ...

Claims

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Application Information

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IPC IPC(8): H04R9/06H04R9/02
CPCH04R9/02H04R9/06H04R2400/11
Inventor 王韬
Owner 深圳市诺维创科技有限公司
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