Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Intelligent sound effect power amplifier chip and intelligent sound effect switching method

A power amplifier chip and sound effect technology, applied in the direction of transducer circuits, sensor components, sensors, etc., can solve time-consuming problems, avoid noise or the probability of damage, improve sound quality, and reduce the number of reads and writes.

Active Publication Date: 2018-04-06
SHANGHAI FOURSEMI SEMICON CO LTD
View PDF10 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As mentioned above, this is very time-consuming, because it takes 30 milliseconds to send a message

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Intelligent sound effect power amplifier chip and intelligent sound effect switching method
  • Intelligent sound effect power amplifier chip and intelligent sound effect switching method
  • Intelligent sound effect power amplifier chip and intelligent sound effect switching method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0019] In order to make the purpose, technical features and advantages of the present invention more understandable to those in the relevant technical field, and to implement the present invention, the technical features and implementation modes of the present invention are specifically explained in conjunction with the attached drawings, and listed The preferred embodiment is further described. The diagrams compared below are intended to express the schematic representations related to the features of the present invention, and are not and need not be completely drawn according to the actual situation. The description about the implementation of this case involves technical content well known to those skilled in the art, and will not be stated again.

[0020] First please refer to figure 1 , figure 1 It is a schematic diagram of internal components of the smart mobile device of the present invention. The smart mobile device M includes a smart audio power amplifier chip 1 ,...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides an intelligent sound effect power amplifier chip arranged in an intelligent mobile device. The intelligent sound effect power amplifier chip is electrically connected with an external integrated circuit and a horn in the intelligent mobile device, and the intelligent sound effect power amplifier chip comprises an integrated circuit bus interface, an integrated circuit built-in audio bus interface, a startup device, a register and a sound effect module. The integrated circuit bus interface and the integrated circuit built-in audio bus interface are used forming a communication connection with the external integrated circuit and the intelligent sound effect power amplifier chip. The startup device is used for starting the intelligent mobile device. After the intelligent mobile device is started, the register imports an audio application scene and sound effect parameters in the external integrated circuit and temporarily stores the audio application scene and the sound effect parameters. The sound effect module reads and operates the audio application scene and the sound effect parameters corresponding to the audio application scene stored in the register according to a sound effect scene instruction so as to generate a sound source signal and send the sound source signal through the horn.

Description

technical field [0001] The present invention relates to an intelligent sound effect power amplifier chip and a switching method of the sound effect power amplifier, in particular to an intelligent sound effect power amplifier chip capable of storing multiple sound effect parameters and a method capable of switching multiple sound effect parameters. Background technique [0002] Smart Audio amplifier chip (Smart Audio amplifier chip) is a kind of amplifying the input audio signal to drive the micro-speaker to make sound, and in the process of driving, it adopts the protection algorithm to protect the temperature and other physical quantities of the speaker in real time, so that the temperature and other The physical quantity is within the tolerance range of the speaker, which ensures that the speaker works in a safe state. [0003] In order to make the speaker work in a safe state and get the best sound effect, the smart sound effect power amplifier chip needs to be configure...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H04R3/00
CPCH04R3/00H04R2420/03
Inventor 丁学欣杨小明何秀安徐剑章林盛新
Owner SHANGHAI FOURSEMI SEMICON CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com