Insulating and heat-conductive silicone grease composition with high heat conductivity and preparation method thereof

Abstract

The invention discloses an insulating and heat-conductive silicone grease composition with high heat conductivity and a preparation method thereof. The heat-conductive silicone grease composition is prepared from polyorganosiloxane, heat-conductive filler and a super-dispersion surface modifying agent, wherein the super-dispersion surface modifying agent has anchoring groups and an organized chain; the length of the organized chain segment is not less than 20; the heat-conductive filler is prepared by selecting graphene and carbon-fiber materials in a specific range to carry out multi-dimension and multiscale compounding with common three-dimensional heat-conductive filler, and the super-dispersion surface modifying agent is combined to carry out high-efficiency modification on a surface,and therefore, the obtained silicone grease has excellent characteristics of good insulativity, low viscosity, high heat conductivity and the like.

Description

technical field [0001] The invention belongs to the field of thermal interface materials, and relates to a high thermal conductivity insulating and thermally conductive silicone grease composition and a preparation method thereof, in particular to a graphene / carbon nanotube material-based insulating and thermally conductive silicone grease with high thermal conductivity and low viscosity Compositions and methods for their preparation. Background technique [0002] With the rapid development of electronic technology, the degree of integration and assembly density of electronic components has been continuously improved. While providing powerful functions, it has also led to a sharp increase in power consumption and heat generation. There are extremely fine uneven gaps between the surface of electronic components and the heat sink. If they are directly installed together, the actual contact area is only 10% of the base area of ​​the heat sink, and the rest are air gaps. Becaus...

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Problems solved by technology

Existing studies have proposed that the use of hyperdispersive surface modifiers to modify thermally conductive fillers has achieved certain results, but because the chain segments of hyperdispersive surface modifiers belong to organic matter, the thermal conductivity is low (about 0.2W / m K) , the length of its chain segment increases the steric hindrance and also introduces more interfacial thermal resistance, which leads to a decrease in the thermal conductivity of the silicone grease. Therefore, the practical application of the hyperdisperse surface modifier is limited to a certain extent.