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Flat plate heat pipe

A flat heat pipe and flat plate technology, applied in the field of heat transfer, can solve the problems of low heat transfer efficiency, achieve the effects of improving heat transfer efficiency, efficient heat dissipation, and reducing flow resistance

Pending Publication Date: 2018-03-06
TECHNICAL INST OF PHYSICS & CHEMISTRY - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the groove and protrusion structure in a single direction inside the shell, the flat heat pipe is more suitable for heat transfer in a one-dimensional direction, and the heat transfer efficiency in a two-dimensional direction on a larger plane is still low, and it is perpendicular to The heat transfer efficiency in the direction of the flat heat pipe surface is also low

Method used

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Embodiment Construction

[0028] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0029] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention.

[0030] Such as Figure 1 to Figure 4 As shown, the present invention provides a fla...

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Abstract

The invention provides a flat plate heat pipe which comprises a flat plate shell, a liquid filled pipe and a capillary core. The interior of the flat plate shell is arranged in a hollow manner. Multiple grooves distributed in cross manner are formed in the upper inner surface and the lower inner surface of the flat plate shell, and every two adjacent grooves are spaced by a protrusion. A small hole communicating with the interior of the flat plate shell is formed in the flat plate shell. The liquid filled pipe is fixedly connected to the flat plate shell through the small hole. The capillary core is arranged in the flat plate shell, and the upper surface and the lower surface of the capillary core are in contact with the protrusions on the upper inner surface and the lower inner surface ofthe flat plate shell correspondingly. A section-closed channel is formed by the capillary core and the grooves. According to the flat plate heat pipe, the heat flux of a heat source can be effectively reduced, thermal homogeneity is good, reliability is high, and the excellent thermal homogeneity can be achieved under the antigravity condition.

Description

technical field [0001] The invention relates to the technical field of heat transfer, in particular to a flat heat pipe. Background technique [0002] With the rapid development of modern electronic technology, electronic equipment has been widely used in various fields of human life. Electronic devices are gradually developing towards high frequency, high speed, and high integration. The functions and complexity of integrated devices are increasing day by day, which leads to increasing heat dissipation power per unit volume of electronic equipment and higher heat dissipation heat flux density, resulting in electronic equipment. Problems with increased failure rates, reduced reliability and service life. [0003] The flat plate heat pipe is a high-efficiency phase change heat transfer device evolved from the traditional heat pipe. It has the advantages of flexible structure, good temperature uniformity, and high heat transfer efficiency. The main structure of a traditional...

Claims

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Application Information

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IPC IPC(8): F28D15/04
CPCF28D15/04
Inventor 赵雅楠梁惊涛
Owner TECHNICAL INST OF PHYSICS & CHEMISTRY - CHINESE ACAD OF SCI
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