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A kind of sintering process of thermistor

A thermistor and process technology, applied in the direction of resistors, resistor manufacturing, resistor chip manufacturing, etc., can solve problems such as sticking knives, product deformation, fragmentation, etc., and achieve the effect of reducing operation difficulty and avoiding sticking knives

Active Publication Date: 2019-02-22
DONGGUAN SENSICOM ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The thermistor is usually packaged with a "cuboid" ceramic chip, and cutting the whole piece into a "cuboid" ceramic chip of a specified size is the most critical process in the production process of the thermistor; the existing thermal The sintering process of the varistor usually adopts the tape casting process when making the ceramic chip. After the tape casting, the chip is cut and glued and then sintered into a ceramic chip. Because the chip is not sintered into porcelain, the chip It is relatively soft, and it is prone to adverse phenomena such as sticking to the knife, product deformation, and sticky chips are not easy to disperse during cutting; in addition, due to the small size of the chip after cutting, chipping, chipping, and chipping are prone to occur after glue removal, and the subsequent process The operation is difficult, and, during sintering, there will be sticking between the cut chips

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] The invention discloses a sintering process of a thermistor, comprising steps:

[0021] Ingredients: weigh the components used to make the thermistor, the components include 35-60 parts of thermistor powder, 20-40 parts of adhesive, 30-60 parts of solvent, and 0.1-2 parts of plasticizer;

[0022] Ball milling: Grinding the components and mixing the ground components to form a mixed slurry;

[0023] Tape casting: put the mixed slurry into the tape casting machine, and form a block through tape casting;

[0024] Degumming: carbonize the organic matter in the block into gas and discharge it;

[0025] The first sintering: place the degummed block flat and sinter it into porcelain;

[0026] The second sintering: After the first sintered block is covered with a flat alumina substrate, it is placed in a sintering furnace for sintering;

[0027] The third sintering: put the block sintered for the second time on the carrier plate for sintering.

[0028] Wherein, the length o...

Embodiment 2

[0034] The difference from Embodiment 1 is that the length of the block is 40mm, and the width of the block is 40mm.

[0035] The temperature of the first sintering is 1050°C; the holding time of the first sintering is 3h; the temperature of the second sintering is 1050°C; the holding time of the second sintering is 3h; the temperature of the third sintering is 1050°C; The holding time for the third sintering is 3h.

Embodiment 3

[0037] The difference with embodiment 1 is that the length of the block is 95mm, and the width of the block is 95mm. The temperature of the first sintering is 1300°C; the holding time of the first sintering is 10h; the temperature of the second sintering is 1300°C; the holding time of the second sintering is 10h; the temperature of the third sintering is 1300°C; The holding time for the third sintering is 10h.

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PUM

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Abstract

The embodiment of the invention discloses a sintering process of a thermal resistor. The process comprises the following steps of primary sintering: flatly placing blocks subjected to glue distribution; performing sintering for forming porcelain; secondary sintering: covering and pressing the blocks subjected to primary sintering by a flat aluminum oxide base sheet; putting the blocks into a sintering furnace for sintering; tertiary sintering: flatly placing the blocks subjected to secondary sintering onto a carrying plate for sintering. The sintering process has the beneficial effects that the sintering process of the thermal resistor provided by the invention has the advantages that the occurrence of adverse phenomena such as cutter sticking, product deformation and sticky sheet scattering difficulty during the cutting can be effectively avoided; meanwhile, the operation difficulty of the block manufacturing process after the glue distribution can be reduced through whole block sintering; the problems of block crushing, edge breaking, corner breaking and sticking sheet occurrence during the sintering can be effectively solved.

Description

【Technical field】 [0001] The invention relates to a sintering process, in particular to a sintering process of a thermistor. 【Background technique】 [0002] The thermistor is usually packaged with a "cuboid" ceramic chip, and cutting the whole piece into a "cuboid" ceramic chip of a specified size is the most critical process in the production process of the thermistor; the existing thermal The sintering process of the varistor usually adopts the tape casting process when making the ceramic chip. After the tape casting, the chip is cut and glued and then sintered into a ceramic chip. Because the chip is not sintered into porcelain, the chip It is relatively soft, and it is prone to adverse phenomena such as sticking to the knife, product deformation, and sticky chips are not easy to disperse during cutting; in addition, due to the small size of the chip after cutting, chipping, chipping, and chipping are prone to occur after glue removal, and the subsequent process The oper...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01C17/00H01C17/30C04B35/64
CPCC04B35/64C04B2235/656C04B2235/661H01C17/006H01C17/30
Inventor 余晏斌
Owner DONGGUAN SENSICOM ELECTRONICS TECH
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