SRAM type FPGA turnover fault injection device and fault injection method

Abstract

The invention provides an SRAM type FPGA turnover fault injection device and fault injection method. An upper computer indicates a lower computer to perform chain device identification, thereby obtaining a device type corresponding to an ID of a target FPGA device; the upper computer selects a working interface and indicates the lower computer to perform configuration bit stream backward reading through the working interface; an original configuration bit stream file of the target FPGA device is obtained; the upper computer indicates the lower computer to finish power-on program loading of thetarget FPGA device by utilizing the original configuration bit stream file of the target FPGA device; the upper computer generates a turnover fault injection bit stream file according to a fault injection type; and the lower computer is indicated to finish fault injection for the target FPGA device through the selected working interface by utilizing the fault injection bit stream file. The shortcomings that an existing hardware fault injection device is complex and high in cost, a test result after injection is low in credibility because an existing fault model for software fault injection isinsufficiently real, and the like can be overcome.

Description

technical field [0001] The present invention relates, in particular, to a SRAM (Static RAM, Static Random Access Memory) type FPGA (Field Programmable Gate Array, Field Programmable Gate Array) flip fault injector and a fault injection method. Background technique [0002] Single event effects mainly include SEU (Single Event Upset, single event flip), SET (Single Event Transient, single event transient pulse), SEL (Single Event Latch, single event lock), etc., among which SEU is the most important form of expression. For the SRAM type FPGA, due to the SRAM process it adopts, it is very prone to single-event effect failures, especially single-event upset failures. From the perspective of the proportion of single event upset faults, configuration memory accounts for the largest proportion, followed by LUT-type RAM, block RAM and flip-flops, and other (such as SET, SEFI) single event effect faults account for a small proportion , the SEU of the configuration memory is the mos...

AI Technical Summary

Problems solved by technology

[0005] Aiming at the problem, the present invention proposes a SRAM type FPGA flipping fault injector and a fault injection method, which can overcome the complexity and high cost of existing hardware fault injection equipment, and the fault model of existing software fault injection is not realistic enough to cause injection Disadvantages such as low reliability of post-test results

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