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Flexible dual-curing resin and preparation method thereof

A dual-curing, flexible technology, applied in the field of flexible dual-curing resin and its preparation, can solve the problem of incomplete curing, and achieve the effect of solving the curing depth and good adhesion effect

Inactive Publication Date: 2018-02-09
YANTAI SEAYU NEW MATERIALS CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to provide a flexible dual-cure resin and its preparation method. The present invention cures the problem of incomplete curing through moisture and ultraviolet light, and at the same time solves the problem of product flexibility.

Method used

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  • Flexible dual-curing resin and preparation method thereof
  • Flexible dual-curing resin and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] Add 65 g of hexamethylene diisocyanate trimer, 0.2 g of p-hydroxyanisole, and 1 g of antioxidant 2,6-di-tert-butyl-4-methylphenol into a three-necked flask with a thermometer, and start to heat up Stir, when the temperature reaches 50 degrees, slowly add 10g of hydroxyethyl acrylate, control the temperature at 75 degrees and react for 2 hours, test the NCO content, after the NCO content reaches 13+-0.5%, add the catalyst dibutyltin dilaurate 0.03g, Polytetrahydrofuran diol (2000) 17g, control the reaction temperature 80 degrees, react for 3 hours, take a sample to test the NCO content and viscosity, the NCO content is 7-9%, when the viscosity is controlled to 50000-80000CP, cool down and discharge the material, and the soft double Cured resin.

Embodiment 2

[0020] Add 64g of isophorone diisocyanate trimer, 0.2g of p-benzoquinone, and 1g of antioxidant triphenyl phosphite into a three-necked flask with a thermometer, start heating and stirring, and slowly add acrylic acid when the temperature reaches 50 degrees 8g of hydroxyethyl ester, control the temperature at 75 degrees for 3 hours, test the NCO content, after reaching the NCO content of 13+-0.5%, add the catalyst dibutyltin dilaurate 0.03g, polytetrahydrofuran diol (1000) 15g, control the reaction The temperature is 80 degrees, react for 3 hours, take a sample to test the NCO content and viscosity, the NCO content is 7-9%, when the viscosity is controlled to 50000-80000CP, cool down and discharge the material to obtain a flexible dual-cure resin.

Embodiment 3

[0022] Add 60 g of hexamethylene diisocyanate trimer, 0.2 g of hydroquinone, and 1 g of antioxidant 2,6-di-tert-butyl-4-methylphenol into a three-necked flask with a thermometer, and start heating and stirring When the temperature reaches 50 degrees, slowly add 10g of hydroxypropyl acrylate, control the temperature at 72 degrees and react for 2.5 hours, test the NCO content, after the NCO content reaches 13+-0.5%, add the catalyst dibutyltin dilaurate 0.03g, poly Tetrahydrofuran diol (3000) 20g, control the reaction temperature 83 degrees, react for 3 hours, take a sample to test the NCO content and viscosity, meet the requirements, the NCO content is 7-9%, and the viscosity is controlled at 50000-80000CP. After cooling down, the material is obtained. Flexible UV / moisture dual cure resin.

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PUM

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Abstract

The invention relates to a flexible dual-curing resin and a preparation method thereof. The flexible dual-curing resin is synthesized from the following raw materials in parts by weight: 40-70 parts of a tripolymer containing three NCO groups, 5-20 parts of hydroxy acrylate, 0.01-0.1 part of a catalyst, 0.1-0.5 part of a polymerization inhibitor, 0.5-2 parts of an antioxidant and 10-30 parts of ahydroxyl-terminated long-chain polymer. According to the flexible dual-curing resin disclosed by the invention, the problem that the resin cannot be cured in a shaded area which cannot be irradiated by ultraviolet light is solved. Meanwhile, due to the long-chain polyether and tetrahydrofuran structure contained in the resin, the flexibility and curing depth problems of the product are solved.

Description

technical field [0001] The invention relates to a flexible dual-curing resin and a preparation method thereof. Background technique [0002] The current environment is deteriorating day by day. In the humid and acidic corrosive gas environment, electrical equipment and electronic printed circuit boards often fail, especially in offshore, underground, and open-air work sites, electrical equipment will be exposed to water vapor, salt spray, and acid gas. Corrosion caused by short-circuit faults, fires, and hidden dangers and losses to personal safety and property safety. [0003] After the electronic components are assembled, the circuit board may be in different environments during use, such as humidity, salt spray, chemical corrosion, vibration, etc., which will cause mildew and corrosion to the circuit board. Electronic protective glue is a special The formulated coating adhesive can be coated on the surface of the circuit board to form a transparent protective film, which...

Claims

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Application Information

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IPC IPC(8): C08G18/79C08G18/67C08G18/48C08G18/10
CPCC08G18/10C08G18/4854C08G18/672C08G18/792C08G18/794C08G18/48
Inventor 郝祥清李峰贺国新张利文
Owner YANTAI SEAYU NEW MATERIALS CORP LTD
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