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Polishing device and process for ceramic tile with polishing grinding heads arranged in multiple rows

A polishing device and grinding head technology, applied in the ceramic tile field, can solve problems such as inability to eliminate pans, and achieve the effects of improving effective coverage, improving production efficiency and product quality, and reducing wear and tear of abrasives

Pending Publication Date: 2018-02-09
KEDA INDUSTRIAL GROUP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When polishing large slabs, due to the lengthening of the swing range, the swing frequency is forced to decrease, and the phenomenon of missed polishing and over-grinding is more prominent. Sometimes more than four grinding heads need to be equipped with the same mesh size to ensure one-time coverage. The surface of the large slab It also cannot eliminate the topography of pans caused by non-uniform polishing

Method used

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  • Polishing device and process for ceramic tile with polishing grinding heads arranged in multiple rows
  • Polishing device and process for ceramic tile with polishing grinding heads arranged in multiple rows
  • Polishing device and process for ceramic tile with polishing grinding heads arranged in multiple rows

Examples

Experimental program
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Effect test

Embodiment 1

[0040]A polishing device with tiles arranged in multiple rows of polishing grinding heads, including a tile feeding system, the tile feeding system is installed on the frame 3, the tile feeding system drives the tiles 13 to feed along the length direction of the tiles 13, and the polishing device also includes The beam system and the grinding head system, the beam system is installed on the frame 13, the beam system includes at least two beams 10 (11) arranged in parallel along the tile feed direction, the grinding head system is at least two groups, and each group of grinding head systems is installed On a beam 10 (11), several grinding heads 21 are arranged on the grinding head system for polishing ceramic tiles 13. The number of beams 10 (11) is greater than the number of groups of grinding head systems, and the grinding head systems are arranged on adjacent beams 10 (11). According to the tiles of different specifications and sizes, the number of groups of the grinding hea...

Embodiment 2

[0049] Such as Figure 10 and 11 As shown, this embodiment only describes the difference from the above embodiment, and the rest of the technical features are the same as the above embodiment. Grinding head 21 and grinding head driving motor 25 are all installed on the crossbeam 10 (11), and the direction that grinding head driving motor 25 is installed is vertical to the direction that tile 13 is fed, that is, the grinding head driving motor 25 and grinding head 21 are connected. Direction is perpendicular to the feeding direction of ceramic tile 13, and the grinding head driving motor 25 is protruded outside the crossbeam 10 (11) and installed, and the length of the crossbeam 10 (11) can be reduced by setting the grinding head driving motor 25 like this.

[0050] Another object of the present invention is to provide a polishing process for ceramic tiles arranged in multiple rows of polishing grinding heads, comprising the steps of:

[0051] (1). The processing area on the ...

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Abstract

The invention discloses a polishing device and process for a ceramic tile with polishing grinding heads arranged in multiple rows. The surface of the ceramic tile is uniformly divided into a pluralityof polishing regions in a width direction of the ceramic tile; and each row of grinding heads is used for polishing one polishing region of the ceramic tile. Compared with the prior art, for the polishing device and process, a middle homogeneous region of the ceramic tile moves outward, and the edge of the ceramic tile is effectively processed; and second inhomogeneous regions of two adjacent polishing regions are overlapped to synthesize homogeneous processing on the whole surface of the ceramic tile. A beam system of the polishing device comprises at least two beams which are arranged in aceramic tile feeding direction in parallel; and at least two groups of grinding head systems are provided with a plurality of grinding heads respectively to be used for polishing the ceramic tile. After the ceramic tile is polished by the method and the device, the effective cover rate of the grinding heads can be greatly increased, omission from polishing is effectively reduced, the processing uniformity of the surface of the ceramic tile is improved, and the technical defects and problems of large occupying area of technological process, more used equipment, large consumption of a grinding apparatus, high production cost, omission from polishing, poor processing uniformity and the like in the prior art are solved.

Description

technical field [0001] The invention relates to the field of ceramic tiles, in particular to a polishing device and process for arranging multiple rows of polishing grinding heads for ceramic tiles. Background technique [0002] Most of the existing ceramic tile industry is dominated by small-sized ceramic tiles, but due to the large pollution caused by small-sized ceramic tiles, it has a great impact on the environment, so it is very important to develop and produce large-sized ceramic tile products, and the specifications are The breakthrough, the tiles can be cut into various sizes at will during the actual laying, the application is flexible and changeable, and the scope of application is wider; at the same time, the large size means fewer seams, the paving effect is complete and elegant, highlighting the high-end atmosphere of the room, and the reduction of gaps It is also easier to clean and take care of. [0003] The existing polishing process and equipment for proce...

Claims

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Application Information

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IPC IPC(8): B24B29/02B24B1/00B24B27/00
CPCB24B1/00B24B27/0069B24B27/0076B24B27/0092B24B29/02
Inventor 徐斌周祖兵丘兆才
Owner KEDA INDUSTRIAL GROUP CO LTD
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