Machining method for elastic hinges

A processing method and elastic hinge technology, applied in the processing field of elastic hinges, can solve problems such as low reliability, difficult application of thinning equipment, complex structure, etc.

Inactive Publication Date: 2018-02-09
SHAANXI SHENGMAI PETROLEUM
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  • Abstract
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Problems solved by technology

The above-mentioned devices have certain deficiencies in actual application, such as low reliability, complex structure, diff

Method used

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Embodiment Construction

[0013] A processing method of an elastic hinge includes a process method of rough machining-semi-finishing-finishing; wherein, rough machining removes 80% of the machining amount. Among them, the modulation treatment is carried out before the rough machining to make it reach HRC25-30, and then the cutting process is carried out. After semi-finishing, carry out artificial aging treatment, vacuum oil quenching to 1020°C, pre-cooling to 750°C into oil, oil temperature 40-60°C, tempering at 200°C, vacuum air quenching at 48°C. Cooling treatment with coolant for finishing machining and grinding of precise surfaces. The process adopts the vertical processing method.

[0014] The processing process of the elastic hinge is: the order of rough machining, half finishing machining and finishing machining. Most of the processing amount is removed by rough machining, which generates heat and processing stress, so attention should be paid to the selection of the three cutting elements to ...

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Abstract

The invention relates to the technical field of electronic special equipment, in particular to a processing method of an elastic hinge. A processing method for an elastic hinge, including a roughing-semi-finishing-finishing process; wherein, roughing removes 80% of the processing amount. The invention can not only solve the technical problems of low reliability and complex structure of the traditional adjustment mechanism, but also perfectly meet the requirements of the wafer processing technology, which requires higher geometrical tolerance accuracy of the mounting surface and positioning surface, flatness, The parallelism should be guaranteed to be on the order of microns, so as to realize the ultra-precision thinning process of the wafer of the equipment.

Description

technical field [0001] The invention relates to the technical field of electronic special equipment, in particular to a processing method of an elastic hinge. Background technique [0002] Since the special equipment for wafer thinning is processing the wafer, according to the requirements of the processing technology, the spindle needs to have a small angle adjustment in the left and right directions and the front and rear directions. In modern production equipment, common angle adjustment mechanisms include: bolt type adjustment mechanism, electromagnetic shrapnel adjustment mechanism, etc. The above-mentioned devices have certain deficiencies in actual application, such as low reliability, complex structure, difficult part processing, and high cost, but mainly because of low precision, it is difficult to apply to thinning equipment. As the precision requirements for ultra-precision machining machinery are getting higher and higher, especially the precision motion mechani...

Claims

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Application Information

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IPC IPC(8): B23P15/14
CPCB23P15/14
Inventor 王耀斌
Owner SHAANXI SHENGMAI PETROLEUM
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