Elastic adjusting mechanism for special semiconductor device

A special equipment and adjustment mechanism technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as low reliability and complex structure, and achieve the effect of reliable structure, compact overall structure, simple and practical structure

Inactive Publication Date: 2010-11-10
CETC BEIJING ELECTRONICS EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide an elastic adjustment mechanism for special equipment for semiconductors, to solve the technical problems of low reliability and complex structure of the traditional adjustment mechanism

Method used

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  • Elastic adjusting mechanism for special semiconductor device
  • Elastic adjusting mechanism for special semiconductor device
  • Elastic adjusting mechanism for special semiconductor device

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Embodiment Construction

[0017] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0018] as attached figure 1 , 2 , Shown in 3 and 4, the elastic adjustment mechanism for semiconductor special equipment of the present invention includes guide rail seat 5, the elastic hinge 4 connecting guide rail seat 5 and axle sleeve 8, the knobs one, two, three 1, which adjust elastic hinge 4 elastic deformation 2 and 3, the rotation stopper 6 arranged on the elastic hinge 4 . The elastic hinge 4 is composed of an inner ring 9 and an outer ring 10 sheathed on the outside of the inner ring 9. The root of the inner ring 9 is set as a bottleneck and is connected to the outer ring 10 at the bottom of the elastic hinge 4 as a whole. There are two through-holes 11 in the lower part, which make the inner ring 9 and the elastic hinge 4 narrow at the lower part connection, in the shape of a bottleneck. The inner ring 9 of the elastic hinge 4 and the bottom of...

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PUM

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Abstract

The invention relates to an adjusting mechanism, and in particular to an elastic adjusting mechanism for a special semiconductor device, which comprises a track block, an elastic hinge, a knob, a press block, a shaft sleeve and a rotation chock block. An elastic hinge inner ring is fixed on the track block through a screw and an adjusting cushion block, a knob C is inserted into the elastic hinge and is connected with the track block through threads, a knob B is screwed into the elastic hinge through threads, the spherical surface on the end part of the knob B is contacted with the track block, a knob A is screwed into the elastic hinge through the threads from two sides, the spherical surface on the end part of the knob A is contacted with the elastic hinge inner ring, the rotation chock block is arranged inside a semi-circular groove of the elastic hinge and is connected with the bottom part of the shaft sleeve, and the shaft sleeve is fixed on an outer ring of the elastic hinge. The knob is used for adjusting the elastic hinge, so the micro-angle adjustment of beta in the transverse direction and alpha in the longitudinal direction can be realized in the processing technology of the wafer. The elastic adjusting mechanism has the advantages of compact structure, simple installation, convenient application and reliable adjustment, and can be widely applicable to the special semiconductor device.

Description

technical field [0001] The invention relates to an adjustment mechanism, in particular to an elastic adjustment mechanism used in semiconductor special equipment. Background technique [0002] During the processing of wafers by semiconductor special equipment, due to the requirements of the processing technology, the spindle needs to have a small angle adjustment of β in the left and right direction and α in the front and rear direction. In modern production equipment, common angle adjustment mechanisms include: bolt type adjustment mechanism, electromagnetic shrapnel adjustment mechanism, etc. The above-mentioned devices have certain deficiencies in actual application, such as low reliability, relatively complex structure, difficult parts processing, high cost, and difficult control. Contents of the invention [0003] The object of the present invention is to provide an elastic adjustment mechanism for semiconductor special equipment, which solves the technical problems ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/68
Inventor 张敏杰王仲康刘金海
Owner CETC BEIJING ELECTRONICS EQUIP
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