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Manufacturing method of target module

A manufacturing method and component technology, which is applied in the field of target component manufacturing, can solve the problems that the target component yield needs to be improved, and achieve the effects of high production process stability, improved bonding strength, and simple welding process

Inactive Publication Date: 2018-02-06
KONFOONG MATERIALS INTERNATIONAL CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, the yield rate of the target components formed by the prior art needs to be improved

Method used

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  • Manufacturing method of target module

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Experimental program
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Embodiment Construction

[0028] It can be seen from the background art that the yield rate of target components in the prior art needs to be improved. Analyze the reasons for this:

[0029] At present, the brazing process is mainly used to realize the welding of the WTi target blank and the Cu back plate to form the target assembly. The brazing process uses solder with a melting point lower than that of the target blank and the back plate, such as indium or tin. During the brazing process, the target blank and the back plate are heated at a temperature lower than the melting point of the target blank and the back plate and higher than the melting point of the solder. After the solder is melted, the surface to be welded of the target blank is It is set opposite to the surface to be welded of the back plate and attached, and the solder diffuses with the target blank and the back plate to achieve a firm connection. However, during the use of the target assembly, when the sputtering power is increased t...

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Abstract

The invention provides a manufacturing method of a target module. The manufacturing method of the target module comprises the following steps: a tungsten titanium target blank and a copper back plateare provided, wherein a surface to be welded of the tungsten titanium target blank is a first welded surface, and a surface to be welded of the copper back plate is a second welded surface; the firstwelded surface and the second welded surface are oppositely arranged and bonded to form an initial target module; and a hot isostatic pressing process is performed on the initial target module to obtain the target module. As the hot isostatic pressing process is performed on the initial target module, large-area welding of the tungsten titanium target blank and the copper back plate can be realized, the bonding strength of the tungsten titanium target blank and the copper back plate can be improved, the formed target module can reach the welding bonding rate of above 99% and the welding strength of above 50 MPa, and desoldering of the target module in the use process can be prevented.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a method for manufacturing a target component. Background technique [0002] Sputtering technology is one of the commonly used processes in the field of semiconductor manufacturing. With the increasing development of sputtering technology, sputtering targets play an increasingly important role in sputtering technology. The quality of sputtering targets directly affects the sputtering technology. Film quality after injection. [0003] In the field of sputtering target manufacturing, the target assembly is composed of a target blank that meets the sputtering performance and a back plate that is combined with the target blank by welding. Among them, tungsten-titanium target blank is a typical alloy target blank. Tungsten-titanium alloy has low resistivity, good thermal stability and oxidation resistance. In the prior art, tungsten-titanium target blank and aluminum alloy ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/34
CPCC23C14/3414
Inventor 姚力军潘杰相原俊夫王学泽段高林
Owner KONFOONG MATERIALS INTERNATIONAL CO LTD
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